Datasheet

LTM8032
14
8032fg
For more information www.linear.com/LTM8032
applicaTions inForMaTion
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8032. The LTM8032 is neverthe
-
less a switching power supply and care must be taken to
minimize
EMI and ensure proper operation. Even with the
high level of integration, you may fail to achieve specified
operation with a haphazard or poor layout. See Figure 4
for a suggested layout.
Ensure that the grounding and heat sinking are acceptable.
A few rules to keep in mind are:
1. Place the R
ADJ
and R
T
resistors as close as possible to
their respective pins.
2. Place the C
IN
capacitor as close as possible to the V
IN
and GND connection of the LTM8032. If a capacitor
is connected to the FIN terminals, place it as close
GND
C
OUT
C
IN
8032 F04
V
IN
FIN
RUN/SS
SYNC
PGOOD
R
ADJ
R
T
AUX
BIAS
V
OUT
GND
OPTIONAL
FIN
CAPACITOR
Figure 4. Layout Showing Suggested External Components,
GND Plane and Thermal Vias (LGA Package)
as possible to the FIN terminals, such that its ground
connection is as close as possible to that of the C
IN
capacitor.
3. Place the C
OUT
capacitor as close as possible to the
V
OUT
and GND connection of the LTM8032.
4. Place the C
IN
and C
OUT
capacitors such that their
ground currents flow directly adjacent or underneath
the LTM8032.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8032.
6. Use vias to connect the GND copper area to the board’s
internal ground plane. Liberally distribute these GND vias
to provide both a good ground connection and thermal
path to the internal planes of the printed circuit board.