Datasheet

LTM4614
14
4614fb
applicaTions inForMaTion
Figure 11. Recommended PCB Layout
M
C
IN1
GND1
GND2
GND1
V
IN1
GND1
GND2
GND2 GND2
GND1
V
OUT2
V
OUT1
V
IN2
GND2
4614 F11
V
OUT1
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12
C
IN2
C
OUT3
C
OUT4
C
OUT1
C
OUT2
I/O PINS
I/O PINS
Safety Considerations
The LTM4614 modules do not provide galvanic isolation
from V
IN
to V
OUT
. There is no internal fuse. If required,
a slow blow fuse with a rating twice the maximum input
current needs to be provided to protect each unit from
catastrophic failure.
Layout Checklist/Example
The high integration of LTM4614 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
• Refer to http://www.linear.com/docs/29812 for device
land pattern and stencil design.
• Use large PCB copper areas for high current paths,
including V
IN
, GND and V
OUT
. It helps to minimize the
PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capaci-
tors next to the V
IN
, GND and V
OUT
pins to minimize
high frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between the top layer and other power layers.
• Do not put vias directly on pads unless they are capped.
Figure 11 gives a good example of the recommended layout.