Datasheet

LTM8025
2
8025fc
For more information www.linear.com/LTM8025
absoluTe MaxiMuM raTings
V
IN
, RUN/SS Voltage ................................................. 36V
ADJ, RT, SHARE Voltage ............................................. 6V
V
OUT
, AUX .................................................................25V
PGOOD, SYNC...........................................................30V
(Note 1)
orDer inForMaTion
pin conFiguraTion
GND
1
A
B
C
BANK 1
BANK 2
BANK 3
D
E
F
G
H
J
K
L
2 3 4
LGA PACKAGE
70-PIN (9mm × 15mm × 4.32mm)
5 6 7
V
OUT
V
IN
RT
SHARE
PGOOD
ADJ
SYNCRUN/SS
AUX
BIAS
T
JMAX
= 125°C, θ
JA
= 24.4°C/W, θ
JC(BOTTOM)
= 11.5°C/W,
θ
JC(TOP)
= 42.7°C/W, θ
JB
= 18.7°C/W
θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER
WEIGHT = 1.8 GRAMS
1
A
B
C
BANK 1
BANK 2
AUX
BIAS
BANK 3
D
E
F
G
H
J
K
L
2 3
V
OUT
GND
RT
SHARE
PGOOD
ADJ
SYNCRUN/SS
V
IN
4
BGA PACKAGE
70-PIN (9mm × 15mm × 4.92mm)
5 6 7
T
JMAX
= 125°C, θ
JA
= 24.4°C/W, θ
JC(BOTTOM)
= 11.5°C/W,
θ
JC(TOP)
= 42.7°C/W, θ
JB
= 18.7°C/W
θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER
WEIGHT = 1.8 GRAMS
BIAS .......................................................................... 25V
V
IN
+ BIAS ................................................................. 56V
Maximum Junction Temperature (Note 2) ............ 125°C
Solder Temperature ............................................... 245°C
PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
DEVICE
FINISH CODE
LTM8025EV#PBF Au (RoHS) LTM8025V e4 LGA 3 –40°C to 125°C
LTM8025IV#PBF Au (RoHS) LTM8025V e4 LGA 3 –40°C to 125°C
LTM8025MPV#PBF Au (RoHS) LTM8025MPV e4 LGA 3 –55°C to 125°C
LTM8025EY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –40°C to 125°C
LTM8025IY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –40°C to 125°C
LTM8025IY SnPb (63/37) LTM8025Y e0 BGA 3 –40°C to 125°C
LTM8025MPY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –55°C to 125°C
LTM8025MPY SnPb (63/37) LTM8025Y e0 BGA 3 –55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Terminal Finish Part Marking:
www.linear.com/leadfree
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and Tray Drawings:
www
.linear.com/packaging