Datasheet

LTC2309
2
2309fd
ABsOLute MAxIMuM RAtInGs
(Notes 1, 2)
ORDeR InFORMAtIOn
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC2309CUF#PBF LTC2309CUF#TRPBF 2309
24-Lead (4mm × 4mm) Plastic QFN
0°C to 70°C
LTC2309IUF#PBF LTC2309IUF#TRPBF 2309
24-Lead (4mm × 4mm) Plastic QFN
–40°C to 85°C
LTC2309CF#PBF LTC2309CF#TRPBF LTC2309F 20-Lead Plastic TSSOP 0°C to 70°C
LTC2309IF#PBF LTC2309IF#TRPBF LTC2309F 20-Lead Plastic TSSOP –40°C to 85°C
LTC2309HF#PBF LTC2309HF#TRPBF LTC2309F 20-Lead Plastic TSSOP –40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
Supply Voltage
V
D
D
.......................................................... 0.3V to 6V
Analog Input Voltage (Note 3)
CH0-CH7, COM, V
REF
,
REFCOMP .................... (GND – 0.3V) to (V
DD
+ 0.3V)
Digital Input Voltage
(Note 3) ............................ (GND – 0.3V) to (V
DD
+ 0.3V)
Digital Output Voltage ...... (GND – 0.3V) to (V
DD
+ 0.3V)
Power Dissipation .............................................. 500mW
Operating Temperature Range
LTC2309C ................................................ 0°C to 70°C
LTC2309I .............................................40°C to 85°C
LTC2309H .......................................... 40°C to 125°C
Storage Temperature Range .................. 65°C to 150°C
Lead Temperature (Soldering, 10 sec)
TSSOP .............................................................. 300°C
24
25
23 22 21 20 19
7 8 9
TOP VIEW
UF PACKAGE
24-LEAD (4mm s 4mm) PLASTIC QFN
10 11 12
6
5
4
3
2
1
13
14
15
16
17
18
CH3
CH4
CH5
CH6
CH7
COM
GND
SDA
SCL
AD1
AD0
V
DD
CH2
CH1
CH0
V
DD
GND
GND
V
REF
REFCOMP
GND
GND
GND
V
DD
T
JMAX
= 150°C, θ
JA
= 37°C/W
EXPOSED PAD (PIN 25) IS GND, MUST BE SOLDERED TO PCB
F PACKAGE
20-LEAD PLASTIC TSSOP
1
2
3
4
5
6
7
8
9
10
TOP VIEW
20
19
18
17
16
15
14
13
12
11
REFCOMP
GND
V
DD
AD0
AD1
SCL
SDA
GND
GND
V
DD
V
REF
COM
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
T
JMAX
= 150°C, θ
JA
= 90°C/W, θ
JC
= 20°C/W
pIn COnFIGuRAtIOn