Datasheet

LTM4616
21
4616ff
For more information www.linear.com/LTM4616
applications inForMation
Figure 17. Recommended PCB Layout
(LGA and BGA PCB Layouts Are Identical with the Exception of Circle Pads for BGA. See Package Description.)
Layout Checklist/Example
The high integration of LTM4616 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con
-
siderations are still necessary.
• Use large PCB copper areas for high current paths,
including V
IN1
, V
IN2
, GND1 and GND2, V
OUT1
and
V
OUT2
. It helps to minimize the PCB conduction loss
and thermal stress.
• Place high frequency ceramic input and output capaci
-
tors next to the V
IN
, GND and V
OUT
pins to minimize
high frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Do not put vias directly on the pads, unless they are
capped or plated over.
• Use a separated SGND ground copper area for com
-
ponents connected
to signal pins. Connect the SGND
to GND underneath the unit.
• For parallel modules, tie the I
TH
, FB and I
THM
pins to-
gether. Use an internal layer to closely connect these
pins
together. All of the I
THM
pins connect to the SGND
of the master regulator, then the master SGND connects
to GND.
Figure 17 gives a good example of the recommended layout.
LTM4616 TOP VIEW
V
IN1
V
OUT1
1 2 3 4 5 6 7 8 109 11 12
L
K
J
H
G
F
E
D
C
B
M
A
4616 F17
GND2 GND2
GND2
V
OUT1
V
OUT2
GND1
GND1
GND2
V
IN1
V
IN2
C
IN1
C
IN2
C
OUT2
C
OUT2
VIA TO GND
EACH CHANNEL
CONTROL1
CONTROL1 & 2
CONTROL2