Datasheet

LTM8023
20
8023fi
For more information www.linear.com/LTM8023
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
packaGe Description
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY
!
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 50
4 3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A MARKED FEATURE
SYMBOL
aaa
bbb
TOLERANCE
0.15 0.10
9.00
BSC
PACKAGE TOP VIEW
LGA 50 0113 REV C
11.25
BSC
PAD 1
CORNER
PADS
SEE NOTES
X
Y
aaa Z
aaa Z
2.72 – 2.92
DETAIL A
PACKAGE SIDE VIEW
DETAIL A
SUBSTRATE
MOLD
CAP
0.27 – 0.37
2.45 – 2.55
bbb Z
Z
1.27
BSC
0.605 – 0.665
0.605 – 0.665
8.89
BSC
7.62
BSC
C(0.30) PAD 1
H B AD C
6 7 5 1 2 3 4
EF
PACKAGE BOTTOM VIEW
PACKAGE IN TRAY LOADING ORIENTATION
G
4.445
4.445
3.175
3.175
1.905
1.905
0.000
0.635
0.635
3.810 3.810
0.9525
0.635
0.3175
2.540 2.540 1.270 1.270
0.000
0.3175 0.3175
SUGGESTED PCB LAYOUT
TOP VIEW
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
LGA Package
50-Lead (11.25mm × 9.00mm × 2.82mm)
(Reference LTC DWG # 05-08-1804 Rev C)
7
3
4
SEE NOTES