Datasheet
LTM4603HV
23
4603hvf
LGA Package
118-Lead (15mm × 15mm)
(Reference LTM DWG # 05-05-1801 Rev Ø)
PACKAGE DESCRIPTIO
U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNATION PER JESD MO-222, SPP-010
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 118
4
3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
SYMBOL
aaa
bbb
eee
TOLERANCE
0.10
0.10
0.03
2.72 – 2.92
DETAIL B
DETAIL A
DETAIL B
SUBSTRATE
MOLD
CAP
0.27 – 0.37
2.45 – 2.55
bbb Z
Z
15
BSC
TOP VIEW
15
BSC
4
PAD 1
CORNER
X
Y
aaa Z
aaa Z
13.97
BSC
1.27
BSC
13.97
BSC
0.12 – 0.28
234567891011
BOTTOM VIEW
C(0.30)
PAD 1
3
PADS
SEE NOTES
1
SUGGESTED SOLDER PAD LAYOUT
TOP VIEW
12
A
B
C
D
E
F
G
H
K
J
L
M
DETAIL A
0.60 – 0.66
0.60 – 0.66
M
YXeee
0.0000
0.6350
0.6350
1.9050
1.9050
3.1750
3.1750
4.4450
4.4450
5.7150
5.7150
6.9850
6.9850
6.9850
5.7150
5.7150
4.4450
4.4450
3.1750
3.1750
1.9050
1.9050
0.6350
0.6350
0.0000
6.9850
LGA 118 0306 REV Ø
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.