Datasheet

LTM4601/LTM4601-1
26
4601fd
For more information www.linear.com/LTM4601
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
4 3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
PIN 1
3
SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
BGA 118 0112 REV A
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
DETAIL A
0.0000
0.0000
DETAIL A
Øb (118 PLACES)
DETAIL B
SUBSTRATE
0.27 – 0.37
2.45 – 2.55
// bbb Z
D
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
0.630 ±0.025 Ø 118x
SYMBOL
A
A1 A2
b
b1
D
E
e F
G
aaa
bbb
ccc
ddd
eee
MIN
3.22 0.50 2.72 0.60 0.60
NOM
3.42 0.60 2.82 0.75 0.63 15.0 15.0 1.27
13.97 13.97
MAX
3.62 0.70 2.92 0.90 0.66 0.15 0.10 0.20 0.30 0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 118
E
b
e
e
b
A2
F
G
BGA Package
118-Lead (15mm × 15mm × 3.42mm)
(Reference LTC DWG # 05-08-1903 Rev A)
0.6350 0.6350 1.9050 1.9050 3.1750 3.1750 4.4450 4.4450 5.7150 5.7150 6.9850
6.9850
6.9850
5.7150
5.7150
4.4450
4.4450
3.1750
3.1750
1.9050
1.9050
0.6350
0.6350
6.9850
FGHM L JK E ABCD
2 1 4 3 5 6 7 12 8 9 10 11