Datasheet

ADV7390/ADV7391/ADV7392/ADV7393 Data Sheet
Rev. J | Page 18 of 107
ABSOLUTE MAXIMUM RATINGS
Table 13.
Parameter
1
Rating
V
AA
to AGND −0.3 V to +3.9 V
V
DD
to DGND
−0.3 V to +2.3 V
PV
DD
to PGND −0.3 V to +2.3 V
V
DD_IO
to GND_IO −0.3 V to +3.9 V
AGND to DGND −0.3 V to +0.3 V
AGND to PGND −0.3 V to +0.3 V
AGND to GND_IO −0.3 V to +0.3 V
DGND to PGND −0.3 V to +0.3 V
DGND to GND_IO −0.3 V to +0.3 V
PGND to GND_IO −0.3 V to +0.3 V
Digital Input Voltage to GND_IO −0.3 V to V
DD_IO
+ 0.3 V
Analog Outputs to AGND −0.3 V to V
AA
Max CLKIN Input Frequency 80 MHz
Storage Temperature Range (t
S
) −60°C to +150°C
Junction Temperature (t
J
) 150°C
Lead Temperature (Soldering, 10 sec) 260°C
1
Analog output short circuit to any power supply or common can be of an
indefinite duration.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 14. Thermal Resistance
1
Package Type θ
JA
2
θ
JC-TOP
3
θ
JC-BOTTOM
4
Unit
30-Ball WLCSP 35 1 N/A °C/W
32-Lead LFCSP
27
32
1.2
°C/W
40-Lead LFCSP
26
32
1
°C/W
1
Values are based on a JEDEC 4-layer test board.
2
With the exposed metal paddle on the underside of the LFCSP soldered to
the PCB ground.
3
This is the thermal resistance of the junction to the top of the package.
4
This is the thermal resistance of the junction to the bottom of the package.
The ADV7390/ADV7391/ADV7392/ADV7393 are RoHS-
compliant, Pb-free products. The lead finish is 100% pure Sn
electroplate. The device is suitable for Pb-free applications up to
255°C (±5°C) IR reflow (JEDEC STD-20).
The ADV7390/ADV7391/ADV7392/ADV7393 are backward
compatible with conventional SnPb soldering processes. The
electroplated Sn coating can be soldered with SnPb solder pastes
at conventional reflow temperatures of 220°C to 235°C.
ESD CAUTION
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