Service Manual Internal Use Only Service Manual KS360 Model : KS360 Date: August, 2008 / Issue 1.
REVISED HISTORY Editor Date Issue Contents of Changes J.P.Kim Jul. 18. 2008 0.1 - S/W Version * The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. * This manual provides the information necessary to install, program, operate and maintain the KS360 Series.
LGE Internal Use Only -4- Copyright © 2008 LG Electronics. Inc. All right reserved.
Table Of Contents 1. INTRODUCTION ...............................7 5. Trouble shooting............................66 1.1 Purpose .................................................. 7 1.2 Regulatory Information............................ 7 1.3 ABBREVIATION ..................................... 9 5.1 Trouble shooting test setup....................66 5.2 Power on Trouble...................................67 5.3 Charging trouble ....................................70 5.4 LCD display trouble..................
LGE Internal Use Only -6- Copyright © 2008 LG Electronics. Inc. All right reserved.
1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of the KS360 Series. 1.2 Regulatory Information A.
1. INTRODUCTION E. Notice of Radiated Emissions The KS360 Series complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G.
1. INTRODUCTION 1.
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2. GENERAL PERFORMANCE 2. GENERAL PERFORMANCE 2.1 H/W Feature Item Standard Battery Feature Comment Li-Polymer, 800mAh AVG TCVR Current 250mA typ @PL5 Standby Current 1.85 mA typ @PP9 Talk time 5.6 hours (GSM TX Level 10) Standby time Over 430 hours (Paging Period:9, RSSI: -85dBm) Charging time Under 3 hours RX Sensitivity EGSM: -105dBm↓, DCS/PCS: -105dBm↓ TX output power EGSM : 32.5dBm (@PL 5) DCS/PCS: 29.5/29.
2. GENERAL PERFORMANCE 2.2 Technical specification Item Description Specification GSM900 TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 ) EGSM TX: 890 + 0.2 x (n-1024) MHz 1 Frequency Band RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 ) DCS1800 TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885) RX: TX + 95 MHz PCS1900 TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810) RX: TX + 80MHz 2 Phase Error 3 Frequency Error RMS < 5 degrees Peak < 20 degrees < 0.
2. GENERAL PERFORMANCE Item Description Specification GSM900/EGSM 5 Offset from Carrier (kHz). Max. dBc 100 +0.5 200 -30 250 -33 400 -60 600 ~ 1,200 -60 1,200 ~ 1,800 -60 1,800 ~ 3,000 -63 3,000 ~ 6,000 -65 6,000 -71 Output RF Spectrum (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz). Max. dBc 100 +0.
2. GENERAL PERFORMANCE Item Description Specification DCS1800/PCS1900 6 7 8 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum 400 -22 (due to switching transient) 600 -24 1,200 -24 1,800 -27 Spurious Emissions Bit Error Ratio Conduction, Emission Status EGSM BER (Class II) < 2.439% @-102dBm DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm 9 Rx Level Report accuracy 10 SLR 11 12 13 8 3 dB Frequency (Hz) Max.(dB) Min.
2. GENERAL PERFORMANCE Item Description Specification 14 STMR 13 5 dB 15 Stability Margin > 6 dB 16 dB to ARL (dB) Level Ratio (dB) -35 17.5 -30 22.5 -20 30.7 -10 33.3 0 33.7 7 31.7 10 25.5 Distortion 17 Side Tone Distortion Three stage distortion < 10% 18 System frequency (26 MHz) tolerance 2.5ppm 19 32.
2. GENERAL PERFORMANCE Item 26 Description Specification Battery Bar Number Voltage( 0.05V) 3 3.74V ~ 4.2V 2 3.64V~3.73V 1 3.45V ~ 3.63V 0 3.35V ~ 3.44V Battery Indicator 3.45V ↓ 0.05V (Call) 3.45V ↓ 0.05V (Standby) 27 Low Voltage Warning 28 Forced shut down Voltage 3.35 Battery Type Li-ion Battery or Li-Polymer Battery Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 800mAh Travel Charger Switching-mode charger Input: 100 ~ 240 V, 50/60Hz Out put: 5.6V, 0.
2. GENERAL PERFORMANCE * EDGE RF Specification (Option: is not serviced for “EDGE mode”) Item 1 2 3 4 Description RMS EVM Peak EVM 95th Percentile EVM Origin Offset Suppression Specification ≥ 9% 30% 15% 30dB GSM900/EGSM 5 Power Level Level Power Toler. Level Power Toler.
2. GENERAL PERFORMANCE Item 6 Description Output RF Spectrum (due to modulation) 7 Output RF Spectrum (due to switching transient) Specification DCS1800, PCS1900 Offset from carrier(kHz) Max. dBc 100 +0.5 200 -30 250 -33 400 -54 600 ~ <1,200 -60 1,200 ~ <1,800 -60 1,800 ~ <3,000 -63 3,000 ~ <6,000 -65 6,000 -71 GSM900/EGSM Offset from carrier(kHz) Max. dBm 400 -23 600 -26 1,200 -27 1,800 --30 DCS1800, PCS1900 LGE Internal Use Only Offset from carrier(kHz) Max.
3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 KS360 series Component Block diagram Figure 1. KS360 series Functional Block Diagram Copyright © 2008 LG Electronics. Inc. All right reserved.
3. TECHNICAL BRIEF 3.
3. TECHNICAL BRIEF 3.2.2 Block Description • Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.
3. TECHNICAL BRIEF - Serial RF Control interface: support of direct conversion RF - A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission - 1 Serial Synchronous SPI compatible interfaces in the controller domain - 1 Serial Synchronous SPI compatible interface in the TEAKLite domain - 2 USART with autobaud detection, hardware flow control and integrated IrDA controller supporting IrDA’s SIR standard (up to 115.
3. TECHNICAL BRIEF 3.2.5 USART Interface KS360 have two UART Drivers as follow : - USART0 : SW upgrade / Calibration - USIF : BT Interface. Table 3. USIF Interface Spec. Resource Name Remark UART0_TXD UART_TX Transmit Data UART0_RXD UART_RX Receive Data USIF_TXD UART_BT_TX Transmit Data USIF_RXD UART_BT_RX Receive Data T_OUT3 UART_BT_RTS Flow Control Signal T_OUT4 UART_BT_CTS Flow Control Signal UART0 USIF 3.2.6 ADC channel BBP ADC block is composed of 7 external ADC channel.
3. TECHNICAL BRIEF 3.2.7 GPIO map Over a hundred allowable resources, KS360 is using as follows except dedicated to SIM and Memory. KS360 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.
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3. TECHNICAL BRIEF 3.3 Power management IC 3.3.1 General Description S-GOLDradio has a highly integrated Power and Battery Management block for mobile handsets. Block Description • Highly efficient step-down converter for main digital baseband supply including Core, DSP and memory interface (External Bus Unit).
3. TECHNICAL BRIEF Figure 3. Top level block diagram of the PMU Block of PMB8888 Copyright © 2008 LG Electronics. Inc. All right reserved.
3. TECHNICAL BRIEF Table 6. LDOs Output Table of PMU Block of PMB8888 LDO Net name Output Voltage Output Current Usage SD1 VSD1_1V5 1.5V 400mA Core & for LDO SD2 1V8_VSD2 1.8V 300mA Memory VAUX 2V9_VAUX 2.9V 150mA BT Power VIO 2V62_VIO 2.62V 100mA Peripherals VSIM 2V9_VSIM 2.9V 22mA SIM card VMME 2V9_VMMC 2.9V 150mA SD Card VAUDIO 2V5_VAUDIO 2.5V 220mA Headset VUSB 3V1_VUSB 3.1V 40mA USB Switch VRF1 2V85_VRF1 2.85V 150mA VRF2 1V5_VRF2 1.
3. TECHNICAL BRIEF 3.3.2 Charging KS360 charge the battery using an external charging IC of Intersil ISL9221 for Li-Polymer battery in 4.2 Volts level. 4.2V~3.74V 3.74V~3.64V 3.64V~3.45V 3.45V~3.35V Figure 5. Battery Block Indication 1 Charging method : CC-CV 2 Charger detect voltage : 4.0 V 3 Charging time : 2h 30m 4 Charging current : 400 mA 5 CV voltage : 4.2 V 6 Cutoff current : 110 mA 7 Full charge indication current (icon stop current) : 110 mA 8 Recharge voltage : 4.15 V 9 Low battery alarm a.
3. TECHNICAL BRIEF 3.4 Power ON/OFF KS360 series Power State : Defined 3cases as follow ] Power-ON : Power key detect (S-GOLDradio PWRON port) ] Power-ON-charging : Charger or USB detect. Remote Power On END 2V0_VRTC KEY_COL7 R221 PWRON 100K R225 2K 3.3M 1 2 R222 END_KEY 10K 3 C226 10u 100K R223 RPWRON 6 5 4 R224 2K R220 END_KEY_IN R219 330K RPWRON_EN KEY_ROW6 EMX18 Q201 END_KEY_IN Figure 6. Remote power on and End-key power on circuit.
3. TECHNICAL BRIEF 3.5 SIM interface KS360 supports 1.8V & 3V plug in SIM, SIM interface scheme is shown in (Figure 7). SIM_DATA, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-GOLDRadio).
3. TECHNICAL BRIEF 3.6 Micro SD external memory Interface In KS360 series a Micro SD slot for external Memory is connected to PMB8888. MICRO SD Connector 100K 100K 2V9_VMMC S500 AXA463062P R504 R503 R502 100K 100K R508 R501 100K R500 100K 2V9_VMMC 2V62_VIO DAT1_2 DUMMY1 DAT0 VSS CLK VDD CMD CD_DAT3 DUMMY2 DAT2 DETECT_A DETECT_B DUMMY3 MMC_D1 MMC_D0 MMC_CLK MMC_CMD MMC_D3 MMC_D2 MMC_DET C526 27p C527 C528 C529 C530 C531 C532 27p 27p 27p 27p 27p 27p C533 27p C534 GND 1u Figure 8.
3. TECHNICAL BRIEF 3.7 Memory 1Gbit NAND Flash & 512Mbit SDRAM employed on KS360 series with 8 bit bus for NAND and 16bit bus for SDRAM thru ADD(0) ~ ADD(24).
3. TECHNICAL BRIEF 3.8 LCD Display LCD module include: - Main LCD: 240x320 262K TFT 2.4” - Backlight : 5 piece of white LED LCD Connector Interface Spec: Table 7. LCD Connector Interface Spec. Pin No.
3. TECHNICAL BRIEF Pin No. Pin Name I/O Description 24 D2 I/O Data[2] for LCD 25 D1 I/O Data[1] for LCD 26 D0 I/O Data[0] for LCD 27 LCD-ID I Menufacture ID 28 VCC1 I Logic 29 VCC1 I Analog 30 RESET I/O LCD reset 31 MLED5 O LED Cathode 32 MLED4 O LED Cathode 34 MLED3 O LED Cathode 34 MLED2 O LED Cathode 35 MLED1 O LED Cathode 36 MLED I LED Anode 37 GND - Ground Copyright © 2008 LG Electronics. Inc. All right reserved.
3. TECHNICAL BRIEF 2V62_VIO R100 100K LCD_BL_PWM IF_MODE3 C100 0.1u R101 R102 0 DIF_VSYNC DIF_RD 0 IFMODE(1) IFMODE(0) DIF_WR DIF_CD DIF_CS DIF_D(7) DIF_D(6) DIF_D(5) DIF_D(4) DIF_D(3) DIF_D(2) DIF_D(1) DIF_D(0) LCD_ID DIF_RESET MLED5 MLED4 MLED3 MLED2 MLED1 MLED CN100 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 VA101 EVLC14S02050 Figure 10. 37pin LCD connector circuit LGE Internal Use Only - 38 - Copyright © 2008 LG Electronics.
3. TECHNICAL BRIEF 3.9 Keypad Switching & Scanning The keypad is controlled by a Key coder IC (PP2106M2). It can be used for scanning keypads up to 8 rows and 8 columns (max 64 keys). PMB8888 control PP2106M2 by KEY_I2C_SCL, KEY_I2C_SDA and KEY_INT. KEY_I2C_SDA 2V62_VIO QWERTY KEY C400 2V62_VIO C420 C421 C414 C415 C416 C417 C418 C419 27p 27p 27p 27p 27p 4.
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3. TECHNICAL BRIEF 3.10 Touch KEY The Touch keypad is controlled by CY8C20434. PMB8888 control CY8C20434 by TOUCH_SCL, TOUCH_SDA and TOUCH_INT. Copyright © 2008 LG Electronics. Inc. All right reserved.
3. TECHNICAL BRIEF LGE Internal Use Only - 42 - Copyright © 2008 LG Electronics. Inc. All right reserved.
3. TECHNICAL BRIEF 3.11 Keypad back-light illumination There are 3 snow white color LEDs on Main PCB and 7 blue color LEDs on Sub PCB for keypad illumination. Sub Keypad Back-light is controlled by S-GOLDradio PWM port which has a duty control function. And Main Keypad Back-light is controlled by S-GOLDradio FLASH_SINK port. The whole configuration of the S-GOLDradio Flash LED circuit is shown in below Figure12.
3. TECHNICAL BRIEF 3.12 LCD back light illumination MAX8630W is a charge pump designed to support PWM control mode. And MAX8630W supports 5 white LEDs. The MAX8630W is capable of driving up to 5 LEDs at a total of 100mA(MAX8630W 100mA). The current sinks may be operated individually or in parallel for driving higher current LEDs. To maximize power efficiency, the charge pump operates in 1X, 1.
3. TECHNICAL BRIEF 3.13 ISP(Image Signal Processor) KS360 Series support Camera resolution up to 2M pixel. Camera Sensor I/F is integrated in the SGOLDradio(PMB8888).
3. TECHNICAL BRIEF 3.14 JTAG & ETM interface connector In case of KS360 series mass production, the JTAG interface connector will not be mount on board. That is only for developing and software debugging purpose. ON BOARD ARM9 JTAG & ETM INTERFACE 1V8_VSD2 CN100 G1 G2 TRST_N TDI TMS TCK RTCK TDO _EXTRST 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 G3 G4 Figure 15. JTAG & ETM Interface Circuit LGE Internal Use Only - 46 - Copyright © 2008 LG Electronics. Inc.
3. TECHNICAL BRIEF 3.15 Audio KS360 series Audio signal flow diagram as following diagram. Figure 16. Audio Signal Flow Diagram Copyright © 2008 LG Electronics. Inc. All right reserved.
3. TECHNICAL BRIEF 3.15.1 Audio amplifier We use MAX9877 Audio AMP, which have speaker & headphone amplifiers. An audio signal path can be selected by I2C command.
3. TECHNICAL BRIEF 3.16 Charging circuit ISL9221 accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the other from a desktop cradle. The ISL9221 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively. Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be used safely.
3. TECHNICAL BRIEF 3.17 BLUETOOTH General Features The BlueCore 5-FM BGA is a single chip radio and baseband IC for Bluetooth 2.4 GHz systems including enhanced data rates (EDR) to 3Mbits/s. It includes an integrated FM receiver with stereo audio output stage and an RDS demodulator. With the on-chip CSR Bluetooth software stack, it provides a fully compliant Bluetooth system to v2.0+EDR of the specification for data and voice communications.
3. TECHNICAL BRIEF Bluetooth Radio - Common TX/RX teminal simplifies external matching, eliminates external antenna switch - No external trimming is required In production - Bluetooth v2.0 + EDR Specification compliant Bluetooth Transmitter - +6 dBm RF Transmit power with level control from on-chip 6-bit DAC over a dynamic range > 30dB - Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch.
3. TECHNICAL BRIEF AUDIO BlueCor -5 F Stereo Analogu Driver F RF Radi UAR RA 2 .4 RO Bluetoot Antenn R IN / OU I/O PI Main PMB 8888 2 .4 GH Radi MM I2S(PCM Processo VBT_2V Figure 21. Bluetooth / FM Radio Block Diagram 3.18 FM Radio • Simultaneous operation with Bluetooth • Support of US/Europe (87.
3. TECHNICAL BRIEF 3.19 18pin Multi Media Interface connector Table 11. Multi media interface pin assign KM380 series MMI Pin Function Description 1 FM_ANT FM radio antenna / Audio ground 2 HS_MIC Headset microphone signal 3 JACK_TYPE Not used 4 HS_OUT_L Headset left sound 5 HS_OUT_R Headset Right sound 6 USB_DP USB_DP 7 UDB_DM USB_DM 8 JACK_DET Headset detect (active low) 9 VBAT Battery voltage 10 VBAT Battery voltage 11 RPWRON_EN Remote power on (active high. 2.
3. TECHNICAL BRIEF 2V62_VIO 18PIN IO CONNECTOR NCS2200SQ2T2G C200 0.1u R200 1M U200 5 4 VINVCC 1 VIN+ OUT GND 3 2 C201 R201 100p HOOK_DETECT 2V5_VAUDIO 330K VBUS_USB R202 1.5K C202 2V62_VIO VCHG 2V5_VAUDIO VBAT 0.
3. TECHNICAL BRIEF 3.20 General Description The RF transceiver is integrated in S-GOLDradio(PMB8888),which suppors quad-band operation for voice and data transfer applications. The whole transceiver function is integrated in main IC, PMB8888 provides 4 LNA inputs for RF receiving and two outputs for PAM input for High/Low band. A direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality. Figure 23.
3. TECHNICAL BRIEF R102 LCD_ID VBAT 0 R103 4.
3. TECHNICAL BRIEF 3.21 Receiver part Figure 25. Receiver Block Diagram of S-GOLDradio The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 25). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
3. TECHNICAL BRIEF 3.22 Transmitter part The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N Sigma-Delta synthesizer without any external components (see Figure26). The analog I/Q modulation data from the baseband is converted to digital, filtered and transformed to polar coordinates.
3. TECHNICAL BRIEF Figure 26. Transmitter Architecture Block Diagram 3.23 RF synthesizer The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as SigmaDelta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator.
3. TECHNICAL BRIEF 3.24 DCXO The transceiver contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with three outputs for the system clock, one output for the GSM baseband and two additional for other subsystems (GPS, Bluetooth, etc.). The only external part of the oscillator is the crystal itself. The overall pulling range of the DCXO consists of eight subranges.
3. TECHNICAL BRIEF 3.26 Power Amplifier Module VBAT C629 1u TQM7M5005 15 8 11 14 9 L606 C634 0.5p 1.2nH 13 C635 0.5p 10 12 C639 0.01u R615 C641 1 DNI PGND C628 10u U600 GSM850_900_IN GND3 GND2 GND1 TX_EN VRAMP BY_CAP2 VBATT BY_CAP1 BS GSM850_900_OUT C630 27p MODE_SELECT DCS_PCS_OUT DCS_PCS_IN 7 R609 1 6 R610 1 5 R611 10K TXLB PA_EN TX_RAMP 4 3 R612 1 2 R613 1 R614 1 1 C636 DNI C640 0.01u C637 DNI PA_BAND PA_MODE TXHB C638 47p C642 DNI Figure 28.
4. PCB layout 4. PCB layout 4.1 Main PCB component placement Main PCB Top LGE Internal Use Only Main PCB Top placement - 62 - Copyright © 2008 LG Electronics. Inc. All right reserved.
4. PCB layout Main PCB bottom Copyright © 2008 LG Electronics. Inc. All right reserved.
4. PCB layout Backup battery Hall Effect S/W Vibrator PAD Bluetooth Antenna Speaker PAD MMI Connector Vibrator Bluetooth & FM radio Chip Battery Connector Camera Connector Key Encoder SIM Connector Memory Power Inductor Main FPCB Conn. BBP Micro SD Socket PAM FEM Mobile Switch MIC LGE Internal Use Only - 64 - Copyright © 2008 LG Electronics. Inc. All right reserved.
4. PCB layout KEY PCB Top Main FPCB Conn. LCD Conn. Touch FPCB Conn. KEY PCB Bottom Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5. Trouble shooting 5.1 Trouble shooting test setup Equipment setup Power on all of test equipment -Connect PIF-UNION JIG or dummy battery to the DUT for power up. -Connect mobile switch cable between Communication test set and DUT when you need to make an phone call. -Follow trouble shooting procedure LGE Internal Use Only - 66 - Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.2 Power on Trouble Check Points -Battery Voltage( Need to over 3.35V) -Power-On Key detection (PWRON signal) VBAT END KB100 R112 END_KEY 150 VA100 EVL14S02200 Remote Power On 2V0_VRTC 2K R220 R219 330K RPWRON_EN R221 PWRON 3.3M R223 RPWRON 2 3 6 5 4 TP1 C226 10u 100K 2K R225 1 EMX18 Q201 END_KEY_IN END END_KEY_IN KEY_COL7 R222 END_KEY Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting START Connect power supply to the DUT Vbat = over 3.35V Yes Check ìPWRONî si gnal of TP1 2.
5. Trouble shooting Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.3 Charging trouble Check Points -Connection of TA (check TA voltage 5.6V) -Charging Current Path component voltage drop -Battery voltage 1 Charging method : CC-CV 2 Charger detect voltage : 4.0 V 3 Charging time : 2h 30m 4 Charging current : 420 mA 5 CV voltage : 4.2 V 6 Cutoff current : 100 mA 7 Full charge indication current (icon stop current) : 100 mA 8 Recharge voltage : 4.15 V 4.2V~3.75V 3.64V~3.
5. Trouble shooting START Yes No 18pin IO(CN200) Is soldered ? Resolder the CN200 TP1 Yes Source pin (TP1) of FL200 = 5.6V ? The TA can be broken Change other TA then retest No TP2 Yes Output pin (TP2) of C212=4.2V? No Check solder U201 or replace it Yes No Battery voltage is over 3.35V? charging until battery Voltage goes up to 3.35V Yes Charge is operating properly Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.
5. Trouble shooting START Check LCD connector combination then LCD test with New LCD Is LCD FPCB normal? No Replace LCD FPCB Yes Signal is normal on 2.62V Signal FL400, FL401, FL402,FL403,FL404 No Check solder and repair Damaged filter Yes Assemble FL400,401,402,403,404 Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.5 Camera Trouble Check Points -Connectors combination -FPCB status CAMERA POWER 1V8_VCAM 2V8_VCAMIO VBAT 9 100K C550 RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND PGND U500 1 VIN 2 EN1 3 EN2 4 NC1 CAM_PWR_EN EUSY0319001 R525 1u C551 2.2u C552 2.2u CAMERA CONNECTOR (ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G) 1V8_VCAM 2V8_VCAMIO C522 C523 C524 C525 7.5p 7.5p 7.5p 7.5p C500 C501 C502 C503 7.5p 7.5p 7.5p 7.
5. Trouble shooting START Check camera connector, 24pin main connector Combination then Camera test With equipped camera module Yes Replace New Camera module Working properly? No Replace Main PCB Yes Replace Camera module Yes Assemble Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.
5. Trouble shooting START Check Speaker tension and Contacts are clear. TP4 Input Signal ( TP1, TP2) is Low(0V)? Yes Replace Main Board TP3 No Check the soldering status Of U303 of main -board TP4 Output Signal( TP3, TP4) is Low(0V)? Yes Replace U303 of main -board TP3 No Receiver Signal( TP5, TP6) High(1.6V)? Replace Receiver Replace Main PCB TP5 TP6 Assemble Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.7 Microphone trouble Check Points -Microphone hole -MICBIAS & Signal come from -Audio signal level of the Microphone -Soldering of components MIC MICBIAS L302 C321 39p TP1 100nH TP3 MIC300 1 P 2 G1 3 G2 4 O L304 C320 MIC_N C319 39p 22n TP2 100nH L303 C318 SPU0409HE5H-PB MIC_P 22n C317 39p EVLC14S02050 100nH VA300 C322 10u START Check microphone sound hole Yes Mic bias ON (2.5V)when call?( TP3,L302) TP1 TP2 No Check mic.
5. Trouble shooting 5.8 Ear-MIc Jack Detection trouble START Check the Ear-Jack detection. Check the soldering status of CN200 No Resoldering or Replace CN200 No Resolder FB202, FB203 Yes Is the status of FB202, FB203( TP1,2) low? Yes The main board has a problem Replace Main PCB Assemble TP1 TP2 Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.
5. Trouble shooting START Check Vibrator Connector Combination Check the signal of OUT300,OUT301 (TP1,2) 176Hz 2Vp-p PWM? No Check the soldering of U302,L300,L301 Yes No Check the signal of C303 (TP4) Voltage is 3.0V? Check the soldering of U300 Yes Check the signal of R304 (TP3) Voltage is 2.6V? Resoldering of Replace U102 Yes Replace Vibrator Assemble Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.
5. Trouble shooting START Check All of LEDs solder Check VBAT No Check BATTERY Yes check GPIO signal(SUB_KEY_BL ,TP2) Voltage of Q100 > 0.7v No Replace TR(Q100) check GPIO signal(QWERTY_KE Y_BL, TP1) Voltage of VA301 < 1.0v No Resolder or Replace VA301 or U102 Yes KEY_LED is operating Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.11 SIM & USD trouble SIM Check Points -Power is working -Socket soldering -Proper SIM is used SIM CONNECTOR DNI 15K TP3 SIM_DATA R523 R522 TP2 2V9_VSIM 2V9_VSIM 2V9_VSIM 4 5 6 10 9 J500 1 C5 C1 2 C6 C2 3 C7 C3 7 GND4 GND1 8 GND3 GND2 C546 DNI TP2 TP1 SIM_RST SIM_CLK C543 C547 C548 220n 22p 1000p TP3 SIM_DATA TP1 SIM_CLK LGE Internal Use Only - 84 - Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting START Check All of SIM card voltage KS360 Series support 1.8V & 2.9V SIM only No 6 pins are soldered well? Resolder pin Yes Yes Check Proper SIM Card Replace Main Board Assemble Copyright © 2008 LG Electronics. Inc. All right reserved.
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5. Trouble shooting START Check Micro SD card voltage (2V9_VMMC) No TF socket pins are well soldered Resolder it (check data line uSD D0~D3 (TP1~4)is 2.9V Yes Check proper uSD? Yes Replace Main Board Assemble Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.
5. Trouble shooting START TP5 TP8 Check Touch Connector Combination Check the voltage of TP1~4. Voltage is 2.8V? TP6 TP7 No Resolder FL403 or Replace Main Board Yes Check the voltage of TP5~8. Voltage is 2.8V? No Replace Main or SUB FPCB Yes Touch IC is well soldered? Rosolder Touch IC Yes Chan ge the Touch window Yes Assemble TP4 TP1~ 3 Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.13 Qwerty Key trouble Key Check Points -Dome switch contacts -Key coder IC soldering 2V62_VIO 0.1uF 2V62_VIO TP3 C420 C414 C415 C416 C417 C418 C419 27p 27p 27p 27p 27p 4.
5. Trouble shooting START Check the Dome switch contacts are clear Check the voltage of TP1~4. Volta ge is 2.6V? No Resolder or Replace U400 No Resolder the component Yes Check soldering of components of U400 Assemble TP2 TP3 TP1 TP4 Domeswitch Fig 6 Waveform of DCXO Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.14 Trouble Shooting of Receiver Part START Setup Test Equipment Cell Power : ñ74dBm EGSM CH30 DCS CH699 VCTCXO Check point VCTCXO MobileSW&FEM PLL Check point PLL Control Check point Mobile SW & FEM Re-Download S/W & CAL Main PCB Bottom LGE Internal Use Only - 92 - Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.14.1 Checking DCXO Circuit Is the waveform of 1pin Similar to Fig.6? X100 No Replace X100 Yes DCXO Circuit is OK. See next page to check PLL Circuit. 1pin : 26MHz DCXO X100 NX3225SA 4 GND2 HOT2 3 1 HOT1 GND1 2 CHG_EN G19 CLKOUT0 U4 REFR W7 XOX W8 XO 26MHz SIM_DATA SIM_CLK SIM_RST V10 CC_IO U9 CC_CLK V9 CC_RST 1pin 1pin DCXO Cicuit Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.14.2 Checking Mobile SW & FEM TP1 VC1 RF C622 33p TP2 VC2 IN GND1 3 PAD602 L605 12nH L604 NA 9 12 14 15 18 19 20 NC1 NC2 VC1 VC2 ANT 1 2 3 4 5 6 7 8 C633 0.75p 17 TP9 11 GSM1800_1900TX 13 GSM850_900TX 5p GSM850RX1 GSM850RX2 GSM900RX1 GSM900RX2 GSM1800RX1 GSM1800RX2 GSM1900RX1 GSM1900RX2 0 C632 22p 2 C631 4 TP10 R608 GND2 PAD601 1 PAD600 5 GND3 GND4 6 OUT CN600 MM8430-2600RB3 GND1 GND2 GND3 GND4 GND5 16 10 C627 33p U601 LMSP43NA-782 C634 0.
5. Trouble shooting Check TP10 of CN600 with RF Cable and TP9 of C631 TP10 Signal same as TP9? No Replace Mobile SW (SW401) Yes Check TP1, TP2 of U600 ? Yes Control Signal is OK ? No Check PMB8888 Yes TP5~8 Signal is OK ? No Replace FEM (U600) Yes Mobile SW & FEM is OK. Check Antenna. EGSM RX ANT SW1 ANT SW2 Mobile SW Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.15 Trouble Shooting of Transmitter Part Setup Test Equipment Cell Power : ñ74dBm EGSM CH30 DCS CH699 Check point DCXO Check point Transceiver DCXO Check point PA Control Signal FEM & MS Transceiver PowerAmp Check FEM & Mobile SW Re-Download S/W & RF CAL Main PCB Bottom 5.15.1 Checking DCXO Circuit See RX Part “1. Checking DCXO Circuit” LGE Internal Use Only - 96 - Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.15.
5. Trouble shooting Check Output Signal (TP1, TP2) N0 Signals are Normal ? Replace PMB8888(U102) Yes Transceiver is OK. See next page to check PAM Control Circuit. TXLB (MODE: GMSK) : TP1 TXLB (MODE: 8PSK) : TP1 Transceiver Output (GMSK) Transceiver Output (8PSK) LGE Internal Use Only - 98 - Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.15.
5. Trouble shooting Check Control Signals (TP1, TP2, TP3) No Signals are Normal ? Check PMB8888(U102) Yes PAM Control Signal is OK. See next page to check FEM & Mobile SW Circuit. GSMK Control Signal 8PSK Control Signal TP1(TX RAMP) TP2(PA EN) TP1(TX RAMP) TP2(PA EN) TP3(PA MODE) TP1(TX RAMP) TP3(PA MODE) TP3(PA MODE) : R616 TP1(TX_RAMP) : R612 TP2(PA_EN) : R614 TP2(PA EN) TP3(PA MODE) LGE Internal Use Only - 100 - Copyright © 2008 LG Electronics. Inc. All right reserved.
5. Trouble shooting 5.15.4 Checking FEM & Mobile SW TP1 RF VC1 C622 33p TP2 VC2 IN GND1 3 PAD602 L605 12nH L604 NA 9 12 14 15 18 19 20 NC1 NC2 VC1 VC2 ANT 1 2 3 4 5 6 7 8 C633 0.75p 17 TP9 11 GSM1800_1900TX 13 GSM850_900TX 5p GSM850RX1 GSM850RX2 GSM900RX1 GSM900RX2 GSM1800RX1 GSM1800RX2 GSM1900RX1 GSM1900RX2 0 C632 22p 2 C631 4 TP10 R608 GND2 PAD601 1 PAD600 5 GND3 GND4 6 OUT CN600 MM8430-2600RB3 GND1 GND2 GND3 GND4 GND5 16 10 C627 33p U601 LMSP43NA-782 C634 0.
5. Trouble shooting Check TP6 of CN600 with RF Cable and TP9 of C631 TP10 Signal same as TP10? No Replace Mobile SW (CN600) Yes Check TP1, TP2 of U600 ? Yes Control Signal is OK ? No Check PMB8888(U102) Yes TP9 Signal is OK ? No Replace FEM (U600) Yes Mobile SW & FEM is OK. Check Antenna. EGSM TX TP1(ANT SW1) TP2(ANT SW2) Mobile SW LGE Internal Use Only FEM Control Signals - 102 - Copyright © 2008 LG Electronics. Inc. All right reserved.
6. Download & S/W upgrade 6. Download & S/W upgrade 6.1 S/W download setup S/W download & upgrade setup Preparation • Target terminal • PIF-Union • RS-232 Cable and PIF-UNION to Phone interface Cable • Power Supply or Battery • PC supporting RS-232 with Windows 2000 or newer. If you are going to use battery, the voltage of the battery should be over 3.7V for stable power supplying during S/W download. Copyright © 2008 LG Electronics. Inc. All right reserved.
6. Download & S/W upgrade 6.2 Download program user guide 6.2.1 After “GSMULTI” folder copy, paste C:\ 6.2.2 “MultiGSM.exe” execution file execute KS360 LGE Internal Use Only KS360 KS36 - 104 - Copyright © 2008 LG Electronics. Inc. All right reserved.
6. Download & S/W upgrade 6.3 Multi-Download Program Setting(Model-Base) ■ Multi-Download ■ Setting Program Execution → Setting : Configuration Completed KC550 KC550 KC550 KC550 KC550 KC550 Copyright © 2008 LG Electronics. Inc. All right reserved.
6. Download & S/W upgrade ■ Stand-by Condition: “Wait phone connecting” confirm → Phone connection KS360 KS3 0 LGE Internal Use Only KS360 KS3 - 106 - Copyright © 2008 LG Electronics. Inc. All right reserved.
7. CIRCUIT DIAGRAM 1V5_VRF2 2V8_VVIB 3V1_VUSB C101 2.2u C100 2.2u C106 C107 1u 1u 10 9 R100 0 R101 0 0.1u GND1 2 26MHz U10 R8 R10 T9 R9 T10 E18 VSS_RTC D18 VDD_RTC VLED 2.9 10 VAUDIOa 2.5 220 2V5_VAUDIO VRF1 2.85 150 2V85_VRF1 VRF2 1.5 80 1V5_VRF2 VRF3 2.85 150 2V85_VRF3 VPLL 1.5 20 1V5_VPLL VRTC 2.0 VVIB 2.8 140 2V8_VVIB SD1 1.5 400 4 1V5_VSD1 SD2 1.8 300 1V8_VSD2 SU1 5.6 ... 25 0 ...
7. CIRCUIT DIAGRAM 3 2 1 4 5 8 7 6 9 10 2V62_VIO 18PIN IO CONNECTOR NCS2200SQ2T2G C200 0.1u R200 A 1M U200 5 4 VINVCC 1 VIN+ OUT GND 3 2 C201 R201 100p CHARGING IC OVP A HOOK_DETECT VBAT 2V0_VRTC 2V62_VIO VBUS_USB VCHG_OVP 2V5_VAUDIO 330K VBUS_OVP VBUS_USB R202 1.5K VCHG C202 2V62_VIO VCHG 2V5_VAUDIO VBAT 0.
7.
7. CIRCUIT DIAGRAM 2 3 4 2V62_VIO QWERTY KEY KEY_I2C_SDA 1 C400 5 6 7 8 9 10 2V62_VIO 4.
7. CIRCUIT DIAGRAM 2 1 4 3 6 5 7 9 8 10 CAMERA CONNECTOR MICRO SD Connector (ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G) 1V8_VCAM 2V8_VCAMIO A A 2V9_VMMC C526 27p C527 C528 C529 C530 C531 C532 27p 27p 27p 27p 27p 27p C533 27p C534 C535 1u G4 7.5p 7.5p 7.5p 7.5p C504 C505 C506 C507 C500 C501 C502 C503 1 2 3 4 5 6 7 8 9 10 11 12 R514 R516 R517 R518 10 10 10 10 G3 CAM_D(3) CAM_D(2) CAM_D(1) CAM_D(0) 7.5p 7.5p 7.5p 7.5p 7.5p C517 MMC_D2 MMC_DET B 7.5p 7.5p 7.5p 7.
7. CIRCUIT DIAGRAM 1 2 4 3 5 6 7 8 FB600 ANT600 GND1 FEED GND2 VBALUN_BT 0 A 10 2V62_VIO BLUETOOTH_CSR R600 9 L600 NA A AMAN802015LG14 C601 C602 0.1u 1u C610 15p 47n A3 A4 A5 C615 1000p C614 B FM_ANT C616 L601 33nH 820p C617 820p 4 2 1 UB B1 NC_DC G2 NC B2 5 6 18nH C10 B2 C1 B4 G9 D2 E2 F2 C3 D3 E3 F3 G3 J3 G8 B6 H2 C6 A8 B7 C5 F10 F9 E8 E9 B9 B8 A9 A10 J4 K4 RF C621 1.
7.
7.
7. CIRCUIT DIAGRAM 1 2 3 4 6 5 8 7 9 10 A A FROM SLIDE PCB MAIN RECEIVER 2V8_VVIB CN100 G1 G2 1 2 3 4 5 TOUCH_RST RCV_P RCV_N G3 R100 0 R102 0 + OUT100 RCV_P 10 9 8 7 6 TOUCH_INT TOUCH_SDA TOUCH_SCL RCV_N G4 OUT101 C101 47p C102 47p Header B C C TO TOUCH FPCB 2V8_VVIB D D CN102 G1 G2 1 2 3 4 5 TOUCH_INT TOUCH_SDA TOUCH_SCL 10 9 8 7 6 G3 TOUCH_RST G4 Socket E 1 2 Copyright © 2007 LG Electronics. Inc. All right reserved.
LGE Internal Use Only - 116 - Copyright © 2008 LG Electronics. Inc. All right reserved.
8. BGM Pin Map 8. BGM Pin Map BGA IC pin check (U102, PMB8888) : Not in use Copyright © 2008 LG Electronics. Inc. All right reserved.
8. BGM Pin Map BGA IC pin check (U100, K5D1G12ACD-D075) : Not in use LGE Internal Use Only - 118 - Copyright © 2008 LG Electronics. Inc. All right reserved.
8. BGM Pin Map BGA IC pin check (U303, MAX9877) : Not in use Copyright © 2008 LG Electronics. Inc. All right reserved.
8. BGM Pin Map BGA IC pin check (M600, BC5FM) : Not in use LGE Internal Use Only - 120 - Copyright © 2008 LG Electronics. Inc. All right reserved.
9. PCB LAYOUT Hall Effect SW U202 No Wallpaper Change Dome SW No Keypad & Press Vibrator Amp U302 No Vibrator Key Encoder U400 No Qwerty Key Main FPCB Connector CN400 No Display No Vibrator No Multi-key No Speaker & Receiver Micro Phone MIC300 No Record Copyright © 2008 LG Electronics. Inc. All right reserved.
9.
9. PCB LAYOUT LED LD100~106 No Multi_Key Backlight Copyright © 2007 LG Electronics. Inc. All right reserved.
9. PCB LAYOUT LCD Filter, ZIP Connector CN100 NO Display Main FPCB Connector CN100 No Display No Power LCD Back Light U100 No Display Touch FPCB Connector CN100 No Touch Sense LGE Internal Use Only - 124 - Copyright © 2008 LG Electronics. Inc. All right reserved.
9. PCB LAYOUT LCD Connector CN100, 101 No Power No Booting No Display Copyright © 2007 LG Electronics. Inc. All right reserved.
9. PCB LAYOUT Touch Connector CN102 No Touch Sense Touch Connector CN100 No Touch Sense LGE Internal Use Only - 126 - Copyright © 2008 LG Electronics. Inc. All right reserved.
10. RF Calibration 10. RF Calibration 10.1 Test Equipment Setup 4.00 V 0.000 A 10.2 Calibration Step 10.2.1 Turn on the Phone 10.2.2 Execute “HK_27.exe” Copyright © 2008 LG Electronics. Inc. All right reserved.
10. RF Calibration 10.2.3 Click “SETTING” Menu 10.2.4 Setup “Ezlooks” menu such as the following figure LGE Internal Use Only - 128 - Copyright © 2008 LG Electronics. Inc. All right reserved.
10. RF Calibration 10.2.5 Setup “Line System” menu such as the following figure Adjust the number of times 10.2.6 Setup Logic operation such as the following figure Operation Mode 1. By- Pass: not control by GPIB 2. Normal : control by GPIB PWR : Power Supply CELL :Call- Test Equipment Copyright © 2008 LG Electronics. Inc. All right reserved.
10. RF Calibration 10.2.7 Select “MODEL” 10.2.8 Click “START” for RF calibration 10.2.9 RF Calibration finishes. LGE Internal Use Only - 130 - Copyright © 2008 LG Electronics. Inc. All right reserved.
10. RF Calibration 10.2.10 Calibration data will be saved to the following folder Copyright © 2008 LG Electronics. Inc. All right reserved.
10. RF Calibration Notices: 1. The state of Phone is “test mode” during the CALIBRATION. 2. Calibration program automatically changes either “normal mode” or “ptest mode”. 3. RF Calibration steps as follow: TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS RX Channel compensation: EGSM->DCS->PCS 4. Phone Operation Mode Normal Mode LGE Internal Use Only ptest Mode - 132 - Copyright © 2008 LG Electronics. Inc. All right reserved.
11. Stand-alone Test 11. Stand-alone Test 11.1 Test Program Setting 1 Set COM Port. 2 Check PC Baud rate. 3 Confirm EEPROM & Delta file prefix name. 4 Click “Update Info” for communicating Phone and Test-Program. Not Connected Copyright © 2008 LG Electronics. Inc. All right reserved.
11. Stand-alone Test Connected 5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar. 6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. Change "ptest mood" LGE Internal Use Only - 134 - Copyright © 2008 LG Electronics. Inc. All right reserved.
11. Stand-alone Test 11.2 Tx Test 1 Click “Non signaling mode” bar and then confirm “OK” text in the command line. 2 Put the number of TX Channel in the ARFCN. 3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu. 4 Finally, Click “Write All” bar and try the efficiency test of Phone. Copyright © 2008 LG Electronics. Inc. All right reserved.
11. Stand-alone Test 11.3 Rx Test 1 Put the number of RX Channel in the ARFCN. 2 Select “Rx” in the RF mode menu. 3 Finally, Click “Write All” bar and try the efficiency test of Phone. 4 The Phone must be changed “normal mode” after finishing Test. 5 Change the Phone to “normal mode” and then Click the “Reset” bar. Change "normal mode" LGE Internal Use Only - 136 - Copyright © 2008 LG Electronics. Inc. All right reserved.
12. ENGINEERING MODE 12. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “1809#*360# “Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back key will switch back to the original test menu.
LGE Internal Use Only - 138 - Copyright © 2008 LG Electronics. Inc. All right reserved.
13. EXPLODED VIEW & REPLACEMENT PART LIST 13.1 EXPLODED VIEW 6 29 1 4 30 26 2 33 32 34 7 25 24 28 31 8 27 21 19 9 35 3 22 14 5 54 23 20 15 13 11 16 12 18 17 10 39 38 41 49 50 52 48 40 37 51 42 53 46 36 43 47 44 Copyright © 2008 LG Electronics. Inc. All right reserved.
ASS'Y EXPLODED VIEW K I G B D J H A LGE Internal Use Only C E F - 140 - K J I H G F E D C B A Copyright © 2008 LG Electronics. Inc. All right reserved.
13. EXPLODED VIEW & REPLACEMENT PART LIST 13.2 Replacement Parts Level Location No.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 4 SNGF00 4 Description Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Part Number Spec ANTENNA,GSM,FIXED SNGF0036402 3.0 ,-2.0 dBd,, ,internal, GSM900/1800/1900 ,; ,TRIPLE ,2.0 ,50 ,3.0 45 SPEAKER SUSY0024802 PIN ,8 ohm,91 dB,16 mm,3.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 SVCY00 CAMERA SVCY0018101 CMOS ,MEGA ,2M FF Toshiba(1/4'),8.5x8.5x4.6,FPCB 5 SJMY00 VIBRATOR,MOTOR SJMY0008504 2.0 V,0.1 A,10*3.6 ,12mm linear motor ,; ,3V , , , , , , , 5 SPKY00 PCB,SIDEKEY SPKY0058801 POLYI ,0.2 mm,MULTI-2 , ,; , , , , , , , , , 5 SPKY01 PCB,SIDEKEY SPKY0058901 POLYI ,0.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C122 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C123 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C124 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C125 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C126 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C127 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C201 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C202 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 6 C203 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C311 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C312 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C315 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C514 CAP,CERAMIC,CHIP ECCH0010501 7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(No X7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] 6 C515 CAP,CERAMIC,CHIP ECCH0010501 7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(No X7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] 6 C516 CAP,CERAMIC,CHIP ECCH0010501 7.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C535 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C536 CAP,CERAMIC,CHIP ECCH0010501 7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(No X7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] 6 C537 CAP,CERAMIC,CHIP ECCH0010501 7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(No X7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] 6 C538 CAP,CERAMIC,CHIP ECCH0010501 7.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C615 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C616 CAP,CHIP,MAKER ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C617 CAP,CHIP,MAKER ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C618 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C619 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C621 CAP,CHIP,MAKER ECZH0000822 1.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 CN201 CONNECTOR,ETC ENZY0020401 3 PIN,2.5 mm,BOTTOM , , 6 CN500 CONNECTOR,BOARD TO BOARD ENBY0020401 24 PIN,0.4 mm,ETC , ,H=0.9, Socket 6 CN600 CONN,RF SWITCH ENWY0001801 STRAIGHT ,SMD ,2 dB,3000PCS/REEL 6 D100 DIODE,SWITCHING EDSY0017301 VSM ,15 V,100 mA,R/TP ,PB-FREE 6 D101 DIODE,SWITCHING EDSY0009901 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t) 6 D102 DIODE,SWITCHING EDSY0009901 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 L605 INDUCTOR,CHIP ELCH0003819 12 nH,J ,1005 ,R/TP , 6 L606 INDUCTOR,CHIP ELCH0001411 1.2 nH,S ,1005 ,R/TP ,PBFREE 6 L607 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE 6 L608 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free 6 L609 INDUCTOR,CHIP ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005 6 L610 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE 6 M600 MODULE,ETC SMZY0015801 84 Ball 0.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C316 CAP,CERAMIC,CHIP ECCH0000147 2.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C423 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP 6 C424 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP 6 C550 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C551 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C552 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 CN400 CONNECTOR,BOARD TO BOARD ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.
13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 U202 IC EUSY0313401 QFN ,4 PIN,R/TP ,1.8X1.2X0.5 size wide input voltage Hall Switch 6 U300 IC EUSY0232816 SON1612-6 ,6 PIN,R/TP ,3.0V ,150mA,LDO 6 U301 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free 6 U302 IC EUSY0335701 QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP 6 U304 IC EUSY0140901 SSOP5-P-0.
Note
Note