User's Manual

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5.3 Shield laser printing
There is laser information on the shield, as shown below：
5.4 Module PCB Package
The recommended modules PCB packaging is shown as below, pay attention to:
1. The black area is the PA circuit part,which needs to be hollowed-out on the PCB of
the motherboard (for heat dissipation), and the temperature sensitive elements
should not be placed around.
2. The 9 yellow dots are the module bottom test points, the corresponding position on
the mount motherboard PCB must NOT be placed with wire;