Technical Specs
Table Of Contents
- Important Notice
- Safety and Hazards
- Limitation of Liability
- Contents
- List of Tables
- List of Figures
- 1: Introduction
- 2: Electrical Specifications
- 3: RF Specifications
- 4: Power
- 5: Software Interface
- 6: Mechanical and Environmental Specifica- tions
- 7: Regulatory Compliance and Industry Certifi- cations
- A: Antenna Specification
- B: Design Checklist
- C: Testing
- AT Command Entry Timing Requirement
- Acceptance Testing
- Certification Testing
- Production Testing
- Functional Production Test
- Quality Assurance Testing
- Suggested Testing Equipment
- Testing Assistance Provided by Lantronix, Inc.
- IOT/Operator Testing
- Extended AT Commands for Testing
- D: Packaging
- E: References
- F: Acronyms
Rev 5 May.21
92
41113694
R
radiated efficiency, total, 60
radiated sensitivity measurement, 40
radiated spurious emissions, 39
radiation patterns, 61
references, 83
regulatory approvals, 57
regulatory information, 57– 59
FCC, 57
reset
timing, 50
RESET#, 17, 32
resistors, external pull-up, 29
RF
antenna cable loss, maximum, 36
antenna connection, considerations, 36
connectors, required, 15
desense
device-generated, 39
harmonic energy, filtering, 39
mitigation suggestions, 39
shielding suggestions, 39
interference
other devices, 39
power supply, 52
wireless devices, 38
RF bands supported
summary, 11
LTE, 41, 42, 70, 72, 74, 76
RF block diagram, expanded, 19, 20
RF specifications, 36– 45
RI, 14
RSE, 39
Rx sensitivity
conducted, 43
S
sales
ordering, 15
SAR backoff, 52
SDKs available, 53
SED
see Smart Error Detection
See also GPS_DISABLE#, 31
See also W_DISABLE#, 31
sensitivity
conducted, RF parameter, 43
defined, 40
radiated measurement, overview, 40
testing, overview, 40
shielding
module, compliance, 36
reducing RF desense, 39
shock specifications, 54
SIB, 14
signals, 30
Full_Card_Power_Off#, 32
RESET#, 32
WWAN_LED#, 33
SIM
capacitor recommendations, 29
card contacts, 26, 28
clock rate, 29
connector, required, 15
electrical specifications, 29
impedance, connectors, 29
interface, 26
interface diagram, 28
operation, 29
SIM Detect, 17
Smart Error Detection
detecting module reset, 52
SMS features, 14
Snow 3G/AES security, 14
software interface, 53
specifications
electrical, 17
environmental specifications, 54– 56
GPS, 44
mechanical, 54– 56
RF, 36– 45
SSS, 14
standalone mode, GPS/GLONASS, 14
standby DC power consumption, averaged, 46
state machines, 49
support
testing assistance by Lantronix, Inc., 79
tools, 53
system acquisition, 14
system block diagram, 18
T
temperature specification
ambient, 54
high, 54
temperature, module. See thermal
testing
overview, 66
acceptance tests, 66
assistance provided by Lantronix, Inc., 79
certification tests, 67
equipment, suggested, 79
interoperability and operator/carrier testing, 79
manual functional test, suggested, 68
production tests, 68
quality assurance tests, 78
RF receive path, LTE, 76
RF receive path, UMTS, 74
RF transmission path, LTE, 72
RF transmission path, UMTS
, 70
suggestions, 66– 80
thermal
considerations, 55– 56
design checklist, 65
dissipation, factors affecting, 55
dissipation, suggestions, 56
testing, module, 56
thermal shock, specification, 54