Technical Specs
Table Of Contents
- Important Notice
- Safety and Hazards
- Limitation of Liability
- Contents
- List of Tables
- List of Figures
- 1: Introduction
- 2: Electrical Specifications
- 3: RF Specifications
- 4: Power
- 5: Software Interface
- 6: Mechanical and Environmental Specifica- tions
- 7: Regulatory Compliance and Industry Certifi- cations
- A: Antenna Specification
- B: Design Checklist
- C: Testing
- AT Command Entry Timing Requirement
- Acceptance Testing
- Certification Testing
- Production Testing
- Functional Production Test
- Quality Assurance Testing
- Suggested Testing Equipment
- Testing Assistance Provided by Lantronix, Inc.
- IOT/Operator Testing
- Extended AT Commands for Testing
- D: Packaging
- E: References
- F: Acronyms
Rev 5 May.21
91
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G
gain
GNSS, 62
maximum, 57, 61
mean effective, 61
mean effective imbalance, 61
M
mean effective gain, 61
mean effective gain imbalance, 61
mechanical specifications, 54– 56
MIB, 14
modem features, 13
GNSS
antenna specifications, recommended, 60, 62
module
power states, 48– 49
GPS
features supported, 14
specifications, 44
GPS_DISABLE#, 17, 30, 31
ground specifications, 25
grounding
connection considerations, 38
H
host interface
pin assignments, 20
humidity specifications, 54
I
I/O rise time requirements, 29
impedance
module–antenna, 37
SIM, 29
industry approvals, 57
integration requirements, 15
interface
control interface
, 30
feature summary, 13
host, pin assignments, 20
QMI, 53
SIM, 26
software, 53
USB, 25
interference
device generated, 39
host-generated, 39
power supply noise, 52
wireless devices, 38
Interoperability testing, 79
intra-LTE mobility, 14
IOT testing, 79
iRAT, 14
isolation, 61, 62
L
LED
example, 34
LED output, 17, 30, 33
LTE
NAS/AS security, 14
noise
leakage, minimizing, 38
RF interference, power supply, 52
O
OEM
assistance with testing, 79
operator/carrier testing, 79
ordering information, 15
P
packaging, 81
paging procedures, 14
PCB
multi-layer, shielding for RF desense, 39
PDN connections, multiple, 14
pin assignments, host interface, 20
PMI, 14
polarization, 62
position location, 14
power
design checklist, 64
handling, 61
power-up timing, 50
ramp-up timing, 50
state machines, 49
states, module, 48– 49
supply, RF interference, 52
supply, ripple limit, 52
power consumption, DC
averaged call mode, 47
averaged standby, 46
power off signal, 17
power specifications, 25
power tolerances, conducted Tx, 44
Product Support Tool, QUALCOMM (QPST), 53
production tests, 68
PSS, 14
Q
3GPP compliance, 57
bandwidth support, 41
features, 14
frequency band support, 41, 42, 70, 72, 74, 76
QMI interface, 53
QPST (QUALCOMM Product Support Tool), 53
QUALCOMM Product Support Tool (QPST), 53
quality assurance tests, 78
QXDM support, 53
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