Technical Specs

Table Of Contents
Rev 5 May.21
83
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E: References
This guide deals specifically with hardware integration issues that are unique to AirPrime
embedded modules.
Lantronix, Inc. Documents
The Lantronix, Inc. documents listed below are available from https://www.lantronix.com/.
For additional documents describing embedded module design, usage, and integration
issues, contact your Lantronix, Inc. account representative.
Command Documents
[1]
AT Command Set for User Equipment (UE) (Release 6) (Doc# 3GPP TS 27.007)
[2]
AirPrime EM75xx and EM/MC74x1 AT Command Reference (Doc# 41111748)
Other Documents
[3]
M.2 Dev Kit Welcome Letter (Doc# 2400323)
[4]
AirCard/AirPrime USB Driver Developer’s Guide (Doc# 2130634)
Industry/ Other Documents
The following non-Lantronix, Inc. references are not included in your documentation
package:
[5]
FCC Regulations - Part 15 - Radio Frequency Devices
[6]
IEC-61000-4-2 level 3 (Electrostatic Discharge Immunity Test)
[7]
Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module
(Doc# 3GPP TS 11.10-4)
[8]
PCI Express NGFF (M.2) Electromechanical Specification Revision 1.0
[9]
Universal Serial Bus Specification, Rev 2.0
[10]
Universal Serial Bus Specification, Rev 3.0
[11] JESD22-A114-B
[12] JESD22-C101
[13]MIPI Alliance Specification for RF Front-End Control Interface
E