Technical Specs
Table Of Contents
- Important Notice
- Safety and Hazards
- Limitation of Liability
- Contents
- List of Tables
- List of Figures
- 1: Introduction
- 2: Electrical Specifications
- 3: RF Specifications
- 4: Power
- 5: Software Interface
- 6: Mechanical and Environmental Specifica- tions
- 7: Regulatory Compliance and Industry Certifi- cations
- A: Antenna Specification
- B: Design Checklist
- C: Testing
- AT Command Entry Timing Requirement
- Acceptance Testing
- Certification Testing
- Production Testing
- Functional Production Test
- Quality Assurance Testing
- Suggested Testing Equipment
- Testing Assistance Provided by Lantronix, Inc.
- IOT/Operator Testing
- Extended AT Commands for Testing
- D: Packaging
- E: References
- F: Acronyms
Rev 5 May.21
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D: Packaging
Lantronix, Inc. AirPrime Embedded Modules are shipped in sealed boxes. The standard
packaging (see Figure 4-1), contains a single tray with a capacity of 100 modules . (Note
that some SKUs may have custom packaging—contact Lantronix, Inc. for SKU-specific
details.)
In the standard packaging, Embedded Modules are inserted, system connector first, into
the bottom portion (T1) of a two-part tray. all facing the same direction. This allows the top
edge of each Embedded Module to contact the top of the triangular features in the top
portion (T2) of the tray (see Detail A).
The top and bottom portions of the tray snap together at the four connection points.
Triangular recesses hold top
edges of modules
System
connector
Tray connection points
Detail
A
See
Detail
A
Figure 4-1: Device Placement in Module Tray
D