Technical Specs

Rev 5 May.21
65
41113694
Design Checklist
Table B-1: Hardware Integration Design Considerations (Continued)
Suggestion Section where discussed
If there is any potential ESD exposure to the primary antenna port, add 39 nH shunt
induction to Ground as close as possible to the external connection.
Provide ESD protection for the SIM connector at the exposed contact point (in
particular, the CLK, VCC, IO, and RESET# lines).
SIM Implementation on
page 29
Keep very low capacitance traces on the UIM_DATA and UIM_CLK signals.
SIM Implementation on
page 29
To minimize noise leakage, establish a very good ground connection between the
module and host.
Ground Connection on page 38
Route cables away from noise sources (for example, power supplies, LCD assemblies,
etc.).
Methods to Mitigate Decreased
Rx Performance on page 39
Shield high RF-emitting components of the host device (for example, main processor,
parallel bus, etc.).
Methods to Mitigate Decreased
Rx Performance on page 39
Use discrete filtering on low frequency lines to filter out unwanted high-order harmonic
energy.
Methods to Mitigate Decreased
Rx Performance on page 39
Use multi-layer PCBs to form shielding layers around high-speed clock traces. Methods to Mitigate Decreased
Rx Performance on page 39
Thermal
Test to worst case operating conditions—temperature, voltage, and operation mode
(transmitter on 100% duty cycle, maximum power).
Thermal Considerations on
page 55
Use appropriate techniques to reduce module temperatures (for example, airflow, heat
sinks, heat-relief tape, module placement, etc.).
Thermal Considerations on
page 55
Host / Modem communication
Make sure the host USB driver supports remote wakeup, resume, and suspend
operations, and serial port emulation.
[4] AirCard/AirPrime USB
Driver Developer’s Guide
(Doc# 2130634)
When no valid data is being sent, do not send SOF tokens from the host (causes
unnecessary power consumption).
[4] AirCard/AirPrime USB
Driver Developer’s Guide
(Doc# 2130634)