Technical Specs
Table Of Contents
- Important Notice
- Safety and Hazards
- Limitation of Liability
- Contents
- List of Tables
- List of Figures
- 1: Introduction
- 2: Electrical Specifications
- 3: RF Specifications
- 4: Power
- 5: Software Interface
- 6: Mechanical and Environmental Specifica- tions
- 7: Regulatory Compliance and Industry Certifi- cations
- A: Antenna Specification
- B: Design Checklist
- C: Testing
- AT Command Entry Timing Requirement
- Acceptance Testing
- Certification Testing
- Production Testing
- Functional Production Test
- Quality Assurance Testing
- Suggested Testing Equipment
- Testing Assistance Provided by Lantronix, Inc.
- IOT/Operator Testing
- Extended AT Commands for Testing
- D: Packaging
- E: References
- F: Acronyms
Rev 5 May.21
26
41113694
Product
Technical
Specification
Host-side Recommendation
Note: When designing the host device, careful PCB layout practices must be followed.
Lantronix, Inc. recommends the host platform include series capacitors on the USB3.0 Rx
signals (no capacitors required for the Tx signals), as shown below.
Figure 2-4: Recommended Capacitor Placement for USB3.0 Signals
USB Throughput Performance
This device has been designed to achieve optimal performance and maximum throughput
using USB superspeed mode (USB 3.0). Although the device may operate with a high
speed host, throughput performance will be on an “as is” basis and needs to be
characterized by the OEM. Note that throughput will be reduced and may vary
significantly based on packet size, host interface, and firmware revision.
User-developed
Drivers
Details for user-developed USB drivers are described in [4] AirCard/AirPrime USB Driver
Developer’s Guide (Doc# 2130634).
SIM Interface
Note: Host support for SIM interface signals is required.
The module supports up to two SIMs (Subscriber Identity Module) (1.8 V or 3 V). Each
SIM holds information for a unique account, allowing users to optimize their use of each
account on multiple devices.
The SIM pins (Table 2-4 on page 27) provide the connections necessary to interface to
SIM sockets located on the host device as shown in Figure 2-5 on page 28. Voltage levels
over this interface comply with 3GPP standards.
Host
100 nF
35
USB3.0-
RX-
100 nF
RX
37
USB3.0-
RX+
EM7411
29
USB3.0-
TX-
100 nF
31
USB3.0-
TX+
100 nF
TX
EDGE Connector