Data Sheet

Data Sheet 98-2947 Rev AA | 3
Series 6 MCM0 Data Sheet
Introduction
Landis+Gyr's Series 6 MCM0 is key to building a single, integrated IoT network for your
utility future. This product is a fully functional Network Interface Card (NIC) in a multi-chip
module form-factor to enable low-cost network and sensor device integration. This
technology is foundational to Landis+Gyr's industry-leading utility IoT networking solution,
Gridstream® Connect. Furthermore, the Series 6 MCM0 provides the flexibility to grow the
value of your IoT platform over time with proven Wi-SUN FAN interoperability as you
integrate todays and future AMI or DA networking equipment and third-party IoT devices.
The device supports RF Mesh IP and Wi-SUN FW stacks.
Figure 1. Series 6 M CM0
Table - 1. Technical Specifications
Element Description
Radio Model S6-MCM0
Communication Protocol (PHY) IEEE 802.15.4-2015
MAC/PHY Features
MAC
Automatic selection of ‘best’ Band based on Link Quality Automatic
selection of ‘best’ Modulation based on Link Quality
PHY
Adaptive Power Control
Precision Output Power Management
Clear Channel Assessment
Hardware Capabilities
Clock Speed 120 MHz
RAM Memory 640 Kbytes
FLASH Memory 2 MB + 4 MB External
RF Modulation IEEE 802.15.4 SUN FSK, O-QPSK & OFDM
RF Bands 902 – 928 MHz
Draft 07.11.2022 A