Datasheet

ManualsBrandsLaird ManualsHeat Conducting Films/FoilsTflex HR420FG Thermal Gap Filler, Square, 228.6x228.6x0.5mm

Tflex HR400 Series

Thermal Gap Filler

Americas: +1.866.928.8181

Europe: +49.(0).8031.2460.0

Asia: +86.755.2714.1166

www.lairdtech.com

PRODUCT DESCRIPTION

Tflex™ HR400 is a cost-effective and compliant gap filler thermal interface material with

excellent thermal performance and great handling for mass-production applications.

The low modulus interface pad conforms to component topography, resulting in little stress

the components, mating chassis or parts. The softness relieves mechanical stress from high

stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex™

HR400’s

recovery properties for applications requiring material rework result in continued

mechanical

integrity even after device rework and re-assembly.

Tflex™ HR400 is naturally tacky on both sides and requires no additional adhesive coating to

inhibit thermal performance. The tack is designed to hold the pad in place during assembly

and

component transport.

FEATURES AND BENEFITS

• Thermal Conductivity 1.8 W/mK

•

Soft and Compliant

•

Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)

•

Naturally tacky for adhesion during assembly and transport

• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

SPECIFICATIONS

TYPICAL PROPERTIES VALUE TEST METHOD

Construction & Composition Ceramic filled silicone sheet N/A

Color Dark Grey Visual

Thickness Range 0.50mm (.020”) – 8.9mm

(0.350”)

N/A

Thickness Tolerance +/- 10% N/A

Thermal Conductivity (W/mK) 1.8 ASTM D5470

Density (g/cc) 1.93 Helium Pycnometer

Hardness (Shore 00) 53 ASTM D2240

Outgassing TML (weight %) 0.32 ASTM E595

Outgassing CVCM (weight %) 0.09 ASTM E595

Temperature Range -50°C to 160°C Laird Test Method

Rth@ 40 mils, 10 psi 1.00 °C–in2/W ASTM D5470 (Modified)

Dielectric Constant @ 1 MHz 4.81 ASTM D150

UL Flammability Rating V-0 UL 94

Volume Resistivity

2 x 10

ohm-cm ASTM D257

Summary of content (2 pages)

PAGE 1
Tflex HR400 Series Thermal Gap Filler PRODUCT DESCRIPTION Tflex™ HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability.
PAGE 2
Tflex HR400 Series Thermal Gap Filler AVAILABILITY STANDARD THICKNESSES • 0.5mm (0.020”) to 8.9mm (0.350”) thick material available in 0.25mm (0.010”) increments • Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts OPTIONS • DC1 proprietary tack eliminating coating • Fiberglass is an option in the 0.020-inch and 0.