User's Manual
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ORDERING INFORMATION
- MODULE ACCESSORIES
- BLOCK DIAGRAM
- FUNCTIONAL BLOCK FEATURES
- TIWI-SL MODULE FOOTPRINT AND PIN DEFINITIONS
- PIN DESCRIPTIONS
- ELECTRICAL SPECIFICATIONS
- DEVICE POWER-UP AND ENABLE
- SPI HOST-CONTROLLER INTERFACE
- SOLDERING RECOMMENDATIONS
- CLEANING
- OPTICAL INSPECTION
- REWORK
- SHIPPING, HANDLING, AND STORAGE
- AGENCY CERTIFICATIONS
- AGENCY STATEMENTS
- OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
- OEM LABELING REQUIREMENTS FOR END-PRODUCT
- OEM END PRODUCT USER MANUAL STATEMENTS
- MECHANICAL DATA
- DEVICE MARKINGS
- CONTACTING LS RESEARCH
TiWi-SL MODULE
DATASHEET
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0085-R0.4 Copyright © 2011 LS Research, LLC Page 5 of 36
TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 1
MODULE ACCESSORIES ................................................................................................... 2
BLOCK DIAGRAM ............................................................................................................... 3
FUNCTIONAL BLOCK FEATURES .................................................................................... 4
WLAN Features ........................................................................................................................................... 4
Network Stack Supported Protocols ......................................................................................................... 4
Wireless Security System Features .......................................................................................................... 4
TIWI-SL MODULE FOOTPRINT AND PIN DEFINITIONS ................................................... 7
PIN DESCRIPTIONS ............................................................................................................ 8
ELECTRICAL SPECIFICATIONS ...................................................................................... 10
Absolute Maximum Ratings ..................................................................................................................... 10
Recommended Operating Conditions .................................................................................................... 10
General Characteristics ............................................................................................................................ 11
WLAN RF Characteristics......................................................................................................................... 13
DEVICE POWER-UP AND ENABLE ................................................................................. 15
SPI HOST-CONTROLLER INTERFACE ........................................................................... 16
Overview .................................................................................................................................................... 16
Supported SPI Features ........................................................................................................................... 16
SPI Interface Description .......................................................................................................................... 16
SPI Transactions ....................................................................................................................................... 17
SOLDERING RECOMMENDATIONS ................................................................................ 26
Recommended Reflow Profile for Lead Free Solder ............................................................................. 26
CLEANING ......................................................................................................................... 27
OPTICAL INSPECTION ..................................................................................................... 27
REWORK ........................................................................................................................... 27