User's Manual
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ORDERING INFORMATION
- MODULE ACCESSORIES
- BLOCK DIAGRAM
- FUNCTIONAL BLOCK FEATURES
- TIWI-SL MODULE FOOTPRINT AND PIN DEFINITIONS
- PIN DESCRIPTIONS
- ELECTRICAL SPECIFICATIONS
- DEVICE POWER-UP AND ENABLE
- SPI HOST-CONTROLLER INTERFACE
- SOLDERING RECOMMENDATIONS
- CLEANING
- OPTICAL INSPECTION
- REWORK
- SHIPPING, HANDLING, AND STORAGE
- AGENCY CERTIFICATIONS
- AGENCY STATEMENTS
- OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
- OEM LABELING REQUIREMENTS FOR END-PRODUCT
- OEM END PRODUCT USER MANUAL STATEMENTS
- MECHANICAL DATA
- DEVICE MARKINGS
- CONTACTING LS RESEARCH
TiWi-SL MODULE
DATASHEET
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0085-R0.4 Copyright © 2011 LS Research, LLC Page 26 of 36
SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”