User's Manual
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ORDERING INFORMATION
- MODULE ACCESSORIES
- BLOCK DIAGRAM
- FUNCTIONAL BLOCK FEATURES
- TIWI-SL MODULE FOOTPRINT AND PIN DEFINITIONS
- PIN DESCRIPTIONS
- ELECTRICAL SPECIFICATIONS
- DEVICE POWER-UP AND ENABLE
- SPI HOST-CONTROLLER INTERFACE
- SOLDERING RECOMMENDATIONS
- CLEANING
- OPTICAL INSPECTION
- REWORK
- SHIPPING, HANDLING, AND STORAGE
- AGENCY CERTIFICATIONS
- AGENCY STATEMENTS
- OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
- OEM LABELING REQUIREMENTS FOR END-PRODUCT
- OEM END PRODUCT USER MANUAL STATEMENTS
- MECHANICAL DATA
- DEVICE MARKINGS
- CONTACTING LS RESEARCH
TiWi-SL MODULE
DATASHEET
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0085-R0.4 Copyright © 2011 LS Research, LLC Page 22 of 36
SPI Timing Information
Figure 9 through Figure 11 show the SPI write and read timing sequences, respectively. Figure 11 is
an expanded view of the first byte timing sequence for the SPI read header shown in Figure 10. Table
13 defines the SPI read/write timing parameters.
Figure 9: SPI Write Timing
Figure 10: SPI Read Transaction