User's Manual
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ORDERING INFORMATION
- MODULE ACCESSORIES
- BLOCK DIAGRAM
- FUNCTIONAL BLOCK FEATURES
- TIWI-SL MODULE FOOTPRINT AND PIN DEFINITIONS
- PIN DESCRIPTIONS
- ELECTRICAL SPECIFICATIONS
- DEVICE POWER-UP AND ENABLE
- SPI HOST-CONTROLLER INTERFACE
- SOLDERING RECOMMENDATIONS
- CLEANING
- OPTICAL INSPECTION
- REWORK
- SHIPPING, HANDLING, AND STORAGE
- AGENCY CERTIFICATIONS
- AGENCY STATEMENTS
- OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
- OEM LABELING REQUIREMENTS FOR END-PRODUCT
- OEM END PRODUCT USER MANUAL STATEMENTS
- MECHANICAL DATA
- DEVICE MARKINGS
- CONTACTING LS RESEARCH
TiWi-SL MODULE
DATASHEET
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0085-R0.4 Copyright © 2011 LS Research, LLC Page 12 of 36
Power Consumption - WLAN
Parameter
Test Conditions
Min
Typical
Max
Unit
CCK (b) TX Current
2437 MHz, VCC=3.3V, T
amb
=+25°C
Po=20 dBm, 11 Mbps CCK
L=1200 bytes, t
delay
(idle)=4 µS.
- 280 - mA
OFDM (g) TX Current
2437 MHz, VCC=3.3V, T
amb
=+25°C
Po=14.5 dBm, 54 Mbps OFDM
L=1200 bytes, t
delay
(idle)=4 µS.
- 185 - mA
CCK (b) RX Current
-
100
-
mA
OFDM (g) RX Current
-
100
-
mA
Dynamic Mode [1]
-
<1.2
-
mA
Table 7: WLAN Power Consumption
[1] Total Current from VCC for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration
1.6ms, 1 Mbps beacon reception in Listen Mode.