User's Manual
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ORDERING INFORMATION
- MODULE ACCESSORIES
- BLOCK DIAGRAM
- FUNCTIONAL BLOCK FEATURES
- TIWI-SL MODULE FOOTPRINT AND PIN DEFINITIONS
- PIN DESCRIPTIONS
- ELECTRICAL SPECIFICATIONS
- DEVICE POWER-UP AND ENABLE
- SPI HOST-CONTROLLER INTERFACE
- SOLDERING RECOMMENDATIONS
- CLEANING
- OPTICAL INSPECTION
- REWORK
- SHIPPING, HANDLING, AND STORAGE
- AGENCY CERTIFICATIONS
- AGENCY STATEMENTS
- OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
- OEM LABELING REQUIREMENTS FOR END-PRODUCT
- OEM END PRODUCT USER MANUAL STATEMENTS
- MECHANICAL DATA
- DEVICE MARKINGS
- CONTACTING LS RESEARCH
TiWi-SL MODULE
DATASHEET
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0085-R0.4 Copyright © 2011 LS Research, LLC Page 11 of 36
General Characteristics
DC Characteristics – General Purpose I/O
Parameter
Test Conditions
Min
Typical
Max
Unit
Logic input low, V
IL
0
-
0.8
V
Logic input high, V
IH
2.0
-
VCC
V
Logic output low, V
OL
8mA
0
-
.55
V
Logic output high, V
OH
8mA
2.0
-
VCC
V
Applies to the SPI signals and the PWR_EN signal.
Table 5: DC Characteristics General Purpose I/O
RF Characteristics
Parameter
Min
Typical
Max
Unit
RF frequency range
2412
2472
MHz
RF data rate 1
802.11 b/g
rates supported
54 Mbps
Table 6: RF Characteristics