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Table Of Contents

TiWi-SL MODULE

DATASHEET

The information in this document is subject to change without notice.

Confirm the data is current by downloading the latest revision from www.lsr.com.

Integrated 802.11 b/g WLAN Module

FEATURES

• IEEE 802.11 b/g compliant.

• Typical WLAN Transmit Power:

o 20.0 dBm, 11 Mbps, CCK (b)

o 14.5 dBm, 54 Mbps, OFDM (g)

• Typical WLAN Sensitivity:

o - 89 dBm, 8% PER,11 Mbps

o -76 dBm, 10% PER, 54 Mbps

• Miniature footprint: 14 mm x 21 mm

• Low height profile: 2.3 mm

• Embedded network stack

• Wireless Security WEP, WPA Personal,

WPA2 Personal

• Terminal for PCB/Chip antenna feeds

• Compact design based on Texas

Instruments CC3000 Transceiver

• SPI host interface

• Simple integration with microcontrollers and

microprocessor

• Low power operation mode

• Worldwide acceptance: FCC (USA), IC

(Canada), and ETSI (Europe)

• RoHS compliant

• Streamlined development with LSR design

services.

APPLICATIONS

• HVAC Control , Smart Energy

• Sensor Networks

• Medical

DESCRIPTION

The TiWi-SL is a high performance 2.4 GHz

WLAN module that contains an IP networking

stacking in a cost effective, pre-certified

footprint.

The module realizes the necessary PHY, MAC,

and NETWORK layers to support WLAN

applications in conjunction with a host

processor over a SPI interface.

Need to get to market quickly? Not an expert in

802.11. Need a custom antenna? Would you

like to own the design? Would you like a

custom design? Not quite sure what you need?

Do you need help with your host board? LS

Research Design Services will be happy to

develop custom hardware or software, integrate

the design, or license the design so you can

manufacture yourself. Contact us at

sales@lsr.com or call us at 262-375-4400.

ORDERING INFORMATION

Order Number

Description

450-0067

TiWi-SL Module

Table 1: Orderable TiWi-SL Model Numbers

Summary of content (36 pages)

PAGE 1
TiWi-SL MODULE DATASHEET Integrated 802.11 b/g WLAN Module FEATURES • DESCRIPTION IEEE 802.11 b/g compliant. • Typical WLAN Transmit Power: o 20.0 dBm, 11 Mbps, CCK (b) o 14.5 dBm, 54 Mbps, OFDM (g) • Typical WLAN Sensitivity: o - 89 dBm, 8% PER,11 Mbps o -76 dBm, 10% PER, 54 Mbps • Miniature footprint: 14 mm x 21 mm • Low height profile: 2.
PAGE 2
TiWi-SL MODULE DATASHEET MODULE ACCESSORIES Order Number Description 001-0001 2.4 GHz Dipole Antenna with Reverse Polarity SMA Connector 080-0001 u.fl to Reverse Polarity SMA Bulkhead Cable 105mm The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0085-R0.
PAGE 3
TiWi-SL MODULE DATASHEET BLOCK DIAGRAM Figure 1: TiWi-SL Module Block Diagram – Top-Level The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0085-R0.
PAGE 4
TiWi-SL MODULE DATASHEET FUNCTIONAL BLOCK FEATURES WLAN Features • • • • • • • • WLAN MAC Baseband Processor and RF transceiver which is IEEE802.11b/g compliant Accepts 26MHz reference clock Input IEEE Std 802.
PAGE 5
TiWi-SL MODULE DATASHEET TABLE OF CONTENTS FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 ORDERING INFORMATION ..................................................
PAGE 6
TiWi-SL MODULE DATASHEET SHIPPING, HANDLING, AND STORAGE ......................................................................... 27 Shipping ..................................................................................................................................................... 27 Handling ..................................................................................................................................................... 27 Moisture Sensitivity Level (MSL) ....................
PAGE 7
TiWi-SL MODULE DATASHEET TIWI-SL MODULE FOOTPRINT AND PIN DEFINITIONS To apply the TiWi-SL module, it is important to use the module pins in your application as they are designated below, and in the corresponding pin definition table found on pages 7 and 8. Not all the pins on the TiWi-SL module may be used, as some are reserved. Figure 2: TiWi-SL Pinout The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com.
PAGE 8
TiWi-SL MODULE DATASHEET PIN DESCRIPTIONS Module Pin Name I/O Type 1 GND GND - GROUND 2 NC - - NO CONNECT (DO NOT CONNECT) 3 NC - - NO CONNECT (DO NOT CONNECT) 4 NC - - NO CONNECT (DO NOT CONNECT) 5 MODE1 DI - MODE1 (SHORT TO MODE2 FOR NORMAL USE, SHORT TO GROUND FOR TEST USE) 6 NC - - NO CONNECT (DO NOT CONNECT) DO - TEST UART TX (1.8V LOGIC) DI - MODE2 (SHORT TO MODE1 FOR NORMAL USE, LEAVE OPEN FOR TEST USE) DI - TEST UART RX (1.
PAGE 9
TiWi-SL MODULE DATASHEET Module Pin Name I/O Type Buffer Type Description 30 SCL_EE (3) DI - I2C CLOCK LINE FROM EEPROM (1.8V LOGIC) 31 SCL_CC (3) DO 4mA I2C CLOCK LINE FROM CC3000, PULL-UP ON MODULE (1.
PAGE 10
TiWi-SL MODULE DATASHEET ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on controlling and conditioning the tests using the evaluation kit and TiWi-SL control software application. Other control conditions may require these values to be re-characterized by the customer. Absolute Maximum Ratings Parameter Min Max Unit Power supply voltage (VCC) -0.5 +3.8 V -0.5 VCC + 0.5 V -0.5 2.
PAGE 11
TiWi-SL MODULE DATASHEET General Characteristics DC Characteristics – General Purpose I/O Parameter Test Conditions Min Typical Max Unit Logic input low, VIL 0 - 0.8 V Logic input high, VIH 2.0 - VCC V Logic output low, VOL 8mA 0 - .55 V Logic output high, VOH 8mA 2.0 - VCC V Applies to the SPI signals and the PWR_EN signal. Table 5: DC Characteristics General Purpose I/O RF Characteristics Parameter Min RF frequency range 2412 RF data rate 1 Typical 802.
PAGE 12
TiWi-SL MODULE DATASHEET Power Consumption - WLAN Parameter Test Conditions Min Typical Max Unit - 280 - mA - 185 - mA CCK (b) RX Current - 100 - mA OFDM (g) RX Current - 100 - mA Dynamic Mode [1] - <1.2 - mA 2437 MHz, VCC=3.3V, Tamb=+25°C CCK (b) TX Current Po=20 dBm, 11 Mbps CCK L=1200 bytes, tdelay (idle)=4 µS. 2437 MHz, VCC=3.3V, Tamb=+25°C OFDM (g) TX Current Po=14.5 dBm, 54 Mbps OFDM L=1200 bytes, tdelay (idle)=4 µS.
PAGE 13
TiWi-SL MODULE DATASHEET WLAN RF Characteristics WLAN Transmitter Characteristics (TA =25°C, VCC=3.3 V) Parameter Test Conditions Min Typ Max Unit 11 Mbps CCK (b) TX Output Power 11 Mbps CCK , 802.11(b) Mask Compliance, 35% EVM RMS power over TX packet - 20 - dBm 9 Mbps OFDM (g) TX Output Power 9 Mbps OFDM , 802.11(g) Mask Compliance, -8 dB EVM RMS power over TX packet - 19 - dBm 54 Mbps OFDM (g) TX Output Power 54 Mbps OFDM, 802.
PAGE 14
TiWi-SL MODULE DATASHEET WLAN Receiver Characteristics (TA =25°C, VCC=3.3V) [1] Parameter Test Conditions Min Typ Max Unit 1 Mbps CCK (b) RX Sensitivity 8% PER - -97 - dBm 11 Mbps CCK (b) RX Sensitivity 8% PER - -89 - dBm 9 Mbps OFDM (g) RX Sensitivity 10% PER - -90 - dBm 54 Mbps OFDM (g) RX Sensitivity 10% PER - -76 - dBm 11 Mbps CCK (b) RX Overload Level. 8% PER -10 - - dBm 6 Mbps OFDM (g) RX Overload Level. 10% PER -20 - - dBm 54 Mbps OFDM (g) RX Overload Level.
PAGE 15
TiWi-SL MODULE DATASHEET DEVICE POWER-UP AND ENABLE Normal operation mode requirements: 1. The MODE1 and MODE2 signals need to be shorted together. The following sequence describes the device power-up from shutdown. See Figure 3 and Table 10 for timing details. Normal operation power-up requirements: 1. Apply power to the module through the VCC input. 2. Wait for the internal 32kHz clock to start-up and stabilize (t1). 3. Enable the module through the PWR_EN input. 4.
PAGE 16
TiWi-SL MODULE DATASHEET SPI HOST-CONTROLLER INTERFACE This section describes the Serial Peripheral Interface ( SPI™) Host-Controller interface (HCI). Overview The SPI interface provides high-speed data transfer capability with low power consumption for mobile electronic devices. The SPI bus was designed to operate on a point-to-multipoint basis by providing a separate, active-low chip select (CS) per device.
PAGE 17
TiWi-SL MODULE DATASHEET Port Name Input/Output Description SPI_CLK Input Clock (0 MHz to 38.4MHz) from host to device SPI_DI Input Data from host to device SPI_CS Input CS signal from host to device SPI_IRQ Output Interrupt from device to host SPI_DO Output Data from device to host Table 11: SPI Interface Signals Description /CS and Bus Sharing Operation The /CS line selects a specific device on the shared SPI bus.
PAGE 18
TiWi-SL MODULE DATASHEET The host must assert /CS (that is, drive the signal to low) to indicate that it is about to write to the device. Consequently, the device will assert the /IRQ line when it is ready to receive the data and after completing its wake-up sequence. The host will wait for the /IRQ line to be asserted and then will start driving the data on the DI line. Data on the DI line consist of a 5-byte header followed by the data payload.
PAGE 19
TiWi-SL MODULE DATASHEET First Write Transaction The first write transaction to occur after release of the shutdown has a slightly different timing than the one shown in Figure 5. The normal SPI host write sequence is /CS low (host  device), followed by /IRQ low (device  host), indicating that the device is ready to accept data. However, after power-up, the sequence is slightly different, as Figure 6 illustrates.
PAGE 20
TiWi-SL MODULE DATASHEET Read Operation: to Host Data Transfer Figure 7 shows the SPI read transaction timing.
PAGE 21
TiWi-SL MODULE DATASHEET Clock Polarity Data is sampled on the falling edge of the clock as shown in Figure 9. Shared SPI Bus Mode This section describes the solution for a system in which the SPI host controller interfaces with other SPI-compatible devices. The topology includes one SPI master and an SPI bus shared by several slaves. The bus topology has a single master (Host) and multiple slaves.
PAGE 22
TiWi-SL MODULE DATASHEET SPI Timing Information Figure 9 through Figure 11 show the SPI write and read timing sequences, respectively. Figure 11 is an expanded view of the first byte timing sequence for the SPI read header shown in Figure 10. Table 13 defines the SPI read/write timing parameters. Figure 9: SPI Write Timing Figure 10: SPI Read Transaction The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com.
PAGE 23
TiWi-SL MODULE DATASHEET Figure 11: SPI Read Header: First Byte Timing Time Min t1 Typ Max Unit 83 375 ns t2 2.9 9.52 ns t3 666 2125 ns t4 83 375 ns Table 13: SPI Read/Write Timing The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0085-R0.
PAGE 24
TiWi-SL MODULE DATASHEET SPI Data Switching Characteristics Parameter tCS Delay time, CS↓to DIN read/write command valid tbusy tEC (1) Min 0 Fixed busy delay till DOUT data valid 32 Delay time, DOUT data valid to CS↑ 0 tDB (2) Max Data block size Unit clock cycles 224 clock cycles clock cycles 32 clock cycles Over recommended operating conditions (See Figure 12, Figure 13) (1)The busy delay can be configured as fixed value after the address de-assertion.
PAGE 25
TiWi-SL MODULE DATASHEET SPI Clock Switching Characteristics This interface only supports single block reads and writes. SPI/WSPI Parameter fclock Clock frequency, CLK Min Max Unit 0 48 ns 40 60 ns ns ns Low/high duty cycle CL < 15pF CL < 15pF tTLH Rise time, CLK CL < 15pF 4.3 tTHL Fall time, CLK CL < 15pF 3.5 Setup time, input valid before CLK↑ CL < 15pF 3.
PAGE 26
TiWi-SL MODULE DATASHEET SOLDERING RECOMMENDATIONS Recommended Reflow Profile for Lead Free Solder Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.” The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com.
PAGE 27
TiWi-SL MODULE DATASHEET CLEANING SHIPPING, HANDLING, AND STORAGE In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. Shipping • • • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads.
PAGE 28
TiWi-SL MODULE DATASHEET AGENCY CERTIFICATIONS FCC ID: TFB-TIWISL01, 15.247. IC ID: 5969A-TIWISL01, RSS 210 ETSI: The European Telecommunications Standards Institute. It produces the radio and communication standards for Europe. Our testing is to the ETSI standards EN 300 328 and EN 301 489, which are the portions of the relevant directives needed for a radio to obtain a CE mark.
PAGE 29
TiWi-SL MODULE DATASHEET Industry Canada Statements Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
PAGE 30
TiWi-SL MODULE DATASHEET OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The TiWi-SL Module has been certified for integration into products only by OEM integrators under the following conditions: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Cana
PAGE 31
TiWi-SL MODULE DATASHEET OEM LABELING REQUIREMENTS FOR END-PRODUCT The TiWi-SL Module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module.
PAGE 32
TiWi-SL MODULE DATASHEET OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.
PAGE 33
TiWi-SL MODULE DATASHEET MECHANICAL DATA Figure 4: Module Mechanical Dimensions (Maximum Module Height = 2.4 mm) The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0085-R0.
PAGE 34
TiWi-SL MODULE DATASHEET Figure 5: TiWi-SL Footprint. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0085-R0.
PAGE 35
TiWi-SL MODULE DATASHEET DEVICE MARKINGS Rev 1 Devices CC3000 Silicon Rev Front End CC3000BYFVR TQM679002A Where R = major revision The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0085-R0.
PAGE 36
TiWi-SL MODULE DATASHEET CONTACTING LS RESEARCH Headquarters LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: (262) 375-4400 Fax: (262) 375-4248 Website http://www.lsr.com Technical Support http://forum.lsr.com Wiki http://wiki.lsr.com/TiWi.ashx Sales Contact sales@lsr.com The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products.