User's Manual
TiWi5TRANSCEIVERMODULE
DATASHEET
The information in this document is subject to change without notice.
330‐0042‐R2.3 Copyright©2011‐2016 Page31of46
CLEANING
Ingeneral,cleaningthepopulatedmodulesis
stronglydiscouraged.Residualsunderthemodule
cannotbeeasilyremovedwithanycleaning
process.
Cleaningwithwatercanleadtocapillaryeffects
wherewaterisabsorbedintothegapbetween
thehostboardandthemodule.The
combinationofsolderingfluxresidualsand
encapsulatedwatercouldleadtoshortcircuits
betweenneighboringpads.Watercouldalso
damageanystickersorlabels.
Cleaningwithalcoholorasimilarorganic
solventwilllikelyfloodsolderingfluxresiduals
intotheRFshield,whichisnotaccessiblefor
post‐washinginspection.Thesolventcouldalso
damageanystickersorlabels.
Ultrasoniccleaningcoulddamagethemodule
permanently.
OPTICALINSPECTION
AftersolderingtheModuletothehostboard,
consideropticalinspectiontocheckthefollowing:
Properalignmentandcenteringofthemodule
overthepads.
Propersolderjointsonallpads.
Excessivesolderorcontactstoneighboring
pads,orvias.
REWORK
Themodulecanbeunsolderedfromthehostboard
iftheMoistureSensitivityLevel(MSL)requirements
aremetasdescribedinthisdatasheet.
Never attempt a rework on the module
itself,e.g.replacingindividualcomponents.
Suchactionswillterminatewarranty
coverage.
SHIPPING,HANDLING,ANDSTORAGE
Shipping
BulkordersoftheTiWi5modulesaredeliveredin
traysof100orreelsof1,000.
Handling
TheTiWi5modulescontainahighlysensitive
electroniccircuitry.HandlingwithoutproperESD
protectionmaydestroyordamagethemodule
permanently.
MoistureSensitivityLevel(MSL)
PerJ‐STD‐020,devicesratedasMSL4andnot
storedinasealedbagwithdesiccantpackshouldbe
bakedpriortouse.
Afteropeningpackaging,devicesthatwillbe
subjectedtoreflowmustbemountedwithin72
hoursoffactoryconditions(<30°Cand60%RH)or
storedat<10%RH.
Bakedevicesfor48hoursat125°C.
Storage
Pleaseusethisproductwithin6monthsafterreceipt.
Anyproductusedafter6monthsofreceiptneedsto
havesolderabilityconfirmedbeforeuse.
Theproductshallbestoredwithoutopeningthe
packingundertheambienttemperaturefrom5to
35deg.Candhumidityfrom20to70%RH.(Packing
materials,inparticular,maybedeformedatthe
temperaturesabovethisrange.)
Donotstoreinsaltyairorinanenvironmentwitha
highconcentrationofcorrosivegas,suchasCl2,
H2S,NH3,SO2,orNOX.
Donotstoreindirectsunlight.
Theproductshouldnotbesubjecttoexcessive
mechanicalshock.