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TiWi5TRANSCEIVERMODULE

DATASHEET

Theinformationinthisdocumentissubjecttochangewithoutnotice.



330‐0042‐R2.3  Copyright©2011‐2016 Page1of46

IntegratedTransceiverModulesforWLAN802.11a/b/g/n,Bluetooth,

BluetoothLowEnergy(BLE),andANT



FEATURES

 IEEE802.11a,b,g,n,d,e,Icompliant

 TypicalWLANTransmitPower:

o 18.3dBm,11Mbps,CCK(b)

o 14.4dBm,54Mbps,OFDM(g)

o 12.5dBm,65Mbps,OFDM(n)

 TypicalWLANSensitivity:

o ‐88dBm,8%PER,11Mbps

o ‐74dBm,10%PER,54Mbps

o ‐72dBm,10%PER,65Mbps

 Bluetooth2.1+EDR,PowerClass1.5

 FullsupportforBLE4.0andANT

 Miniaturefootprint:18mmx13mm

 Lowheightprofile:1.9mm

 TerminalforPCB/Chipantennafeeds

 Worldwideacceptance:FCC(USA),IC(Canada),

andCE(Europe)

 ModularcertificationallowsreuseofLSRFCCID

andETSIcertificationwithoutrepeatingthe

expensivetestingonyourendproduct

 CompactdesignbasedonTexasInstruments

WL1273LTransceiver

 SeamlessintegrationwithTIOMAP™application

processors

 SDIOHostdatapathinterfaces

 BluetoothAdvancedAudioInterfaces

 Lowpoweroperationmodes

 RoHScompliant

 StreamlineddevelopmentwithLSRDesign

Services

APPLICATIONS

 Security

 HVACControl,SmartEnergy

 SensorNetworks

 Medical



DESCRIPTION

TheTiWi5moduleisahighperformance2.4/5.5

GHzIEEE802.11a/b/g/n,Bluetooth2.1+EDR,and

BluetoothLowEnergy(BLE)4.0radioinacost

effective,pre‐certifiedfootprint.



ThemodulerealizesthenecessaryPHY/MAClayers

tosupportWLANapplicationsinconjunctionwitha

hostprocessoroveraSDIOinterface.

ThemodulealsoprovidesaBluetoothplatform

throughtheUARTorbtSPIHCItransportlayer.Both

WLANandBluetoothsharethesameantennaport.

TiWi5ispinforpincompatiblewiththeTiWi‐R2and

TiWi‐BLEmodules.TiWi5doesnotincludetheon

moduleU.FLconnector.

Needtogettomarketquickly?Notanexpertin

802.11orBluetooth?Needacustomantenna?

Wouldyouliketoownthedesign?Wouldyoulike

acustomdesign?Notquitesurewhatyouneed?

Doyouneedhelpwithyourhostboard?LS

ResearchDesignServiceswillbehappytodevelop

customhardwareorsoftware,integratethedesign,

orlicensethedesignsoyoucanmanufacture

yourself.Contactusatsales@lsr.comorcallusat

262‐375‐4400.

Summary of content (46 pages)

PAGE 1
TiWi5 TRANSCEIVER MODULE DATASHEET Integrated Transceiver Modules for WLAN 802.11 a/b/g/n, Bluetooth, Bluetooth Low Energy (BLE), and ANT FEATURES    DESCRIPTION The TiWi5 module is a high performance 2.4 /5.5 GHz IEEE 802.11 a/b/g/n, Bluetooth 2.1+EDR, and Bluetooth Low Energy (BLE) 4.0 radio in a cost effective, pre‐certified footprint. IEEE 802.11 a,b,g,n,d,e,I compliant Typical WLAN Transmit Power: o 18.3 dBm, 11 Mbps, CCK (b) o 14.4 dBm, 54 Mbps, OFDM (g) o 12.
PAGE 2
TiWi5 TRANSCEIVER MODULE DATASHEET ORDERING INFORMATION Order Number Description 450‐0053 TiWi5 Module (Tray, SPQ = 100) 450‐0053R TiWi5 Module (Tape and Reel, SPQ = 1000) Table 1 Orderable TiWi5 Part Numbers MODULE ACCESSORIES Order Number Description 001‐0009 2.4/5.5 GHz Dual‐Band Dipole Antenna with Reverse Polarity SMA Connector 080‐0001 U.FL to Reverse Polarity SMA Bulkhead Cable 105mm Table 2 Module Accessories The information in this document is subject to change without notice.
PAGE 3
TiWi5 TRANSCEIVER MODULE DATASHEET BLOCK DIAGRAM Figure 1 TiWi5 Module Block Diagram – Top‐Level The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 4
TiWi5 TRANSCEIVER MODULE DATASHEET TABLE OF CONTENTS FEATURES...................................................................................................................................... 1 APPLICATIONS ............................................................................................................................... 1 DESCRIPTION ................................................................................................................................ 1 ORDERING INFORMATION ......
PAGE 5
TiWi5 TRANSCEIVER MODULE DATASHEET SOLDERING RECOMMENDATIONS ............................................................................................... 30 Recommended Reflow Profile for Lead Free Solder ........................................................................................... 30 CLEANING ................................................................................................................................... 31 OPTICAL INSPECTION ............................................
PAGE 6
TiWi5 TRANSCEIVER MODULE DATASHEET CONTACTING LS RESEARCH ......................................................................................................... 46 TIWI5 MODULE FOOTPRINT AND PIN DEFINITIONS To apply the TiWi5 module, it is important to use the module pins in your application as they are designated in below and in the corresponding pin definition table found on pages 7 and 8. Not all the pins on the TiWi5 module may be used, as some are reserved for future functionality.
PAGE 7
TiWi5 TRANSCEIVER MODULE DATASHEET PIN DESCRIPTIONS Module Pin Name I/O Type Buffer Type Logic Level 1 VBAT PI ‐ ‐ 2 BT_FUNC5 DO 4 mA 1.8 VDC HOST_WU (*) 3 WL_UART_DBG DIO 4 mA 1.8 VDC WL_UART_DBG 4 WLAN_IRQ DO 4 mA 1.8 VDC WLAN Interrupt Request 5 BT_EN DI ‐ 1.8 VDC Bluetooth Enable 6 FM_EN DI ‐ 1.8 VDC NOT SUPPORTED, CONNECT TO GND 7 WL_RS232_RX DI ‐ 1.8 VDC WLAN TEST UART RX (*) 8 WL_RS232_TX DO 4 mA 1.8 VDC WLAN TEST UART TX (*) 9 FM_I2S_FSYNC DO 4 mA 1.
PAGE 8
TiWi5 TRANSCEIVER MODULE DATASHEET Module Pin Name I/O Type Buffer Type Logic Level 31 FM_AUD_ROUT AO ‐ ‐ NOT SUPPORTED, NO CONNECT 32 FM_AUD_LOUT AO ‐ ‐ NOT SUPPORTED, NO CONNECT 33 AUD_FSYNC DIO 4 mA 1.8 VDC PCM I/F 34 HCI_RX DI 8 mA 1.8 VDC Bluetooth HCI UART RX (*) 35 HCI_RTS DO 4 mA 1.8 VDC Bluetooth HCI UART RTS (*) 36 HCI_TX DIO 8 mA 1.8 VDC Bluetooth HCI UART TX 37 AUD_CLK DO 4 mA 1.8 VDC PCM I/F (*) 38 AUD_OUT DO 4 mA 1.
PAGE 9
TiWi5 TRANSCEIVER MODULE DATASHEET INI FILE RADIO PARAMETERS There is an ini file that contains WLAN radio parameters which are critical to both the RF performance and EMC compliance of the module. The ini file available on the LSR wiki is only intended to be used with the LSR WLAN Eval Tool. Note that this ini file will not work when using the TiWi5 module in normal operation which typically involves an operating system.
PAGE 10
TiWi5 TRANSCEIVER MODULE DATASHEET ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on controlling and conditioning the tests using the TiWi5 control software application. Other control conditions may require these values to be re‐characterized by the customer. Absolute Maximum Ratings Parameter Min Max Unit Power supply voltage (VBAT)(4)(5) ‐0.5 +5.5 V Digital supply voltage (VIO) ‐0.5 2.1 V Voltage on any GPIO ‐0.5 VIO + 0.5 V Voltage on any Analog Pins(3) ‐0.
PAGE 11
TiWi5 TRANSCEIVER MODULE DATASHEET General Characteristics Parameter Min Typ Max Unit WLAN RF frequency range 1 2412 2472 MHz WLAN RF frequency range 2 4910 5835 MHz 65 Mbps 2480 MHz WLAN RF data rate 1 BT RF frequency Range 802.11 a/b/g/n rates supported 2402 Table 6 General Characteristics Power Consumption – WLAN 2.4 GHz Parameter Test Conditions Min Typ Max Unit CCK (802.11b) TX Current 2437 MHz, VBAT =3.6V, Tamb=+25°C Po=18.
PAGE 12
TiWi5 TRANSCEIVER MODULE DATASHEET Power Consumption – WLAN 5 GHz Parameter Test Conditions Min Typ Max Unit OFDM 9 Mbps (802.11a) TX Current 5745 MHz, VBAT =3.6V, Tamb=+25°C Po=17.6 dBm, 9 Mbps OFDM L=1200 bytes, tdelay (idle)=4 S ‐ 296 ‐ mA OFDM 54 Mbps (802.11a) TX Current 5745 MHz, VBAT =3.6V, Tamb=+25°C Po=15.0 dBm, 54 Mbps OFDM L=1200 bytes, tdelay (idle)=4 S ‐ 235 ‐ mA MCS0 6.5 Mbps (802.11a) TX Current 5745 MHz, VBAT =3.6V, Tamb=+25°C Po=18.
PAGE 13
TiWi5 TRANSCEIVER MODULE DATASHEET Power Consumption ‐ Bluetooth Parameter Test Conditions Min Typ Max Unit GFSK TX Current Constant Transmit, 1DH5, PRBS9 ‐ 45 ‐ mA EDR TX Current Constant Transmit, 2DH5,3DH5, PRBS9 ‐ 43 ‐ mA GFSK RX Current Constant Receive, 1DH1 ‐ 35 ‐ mA EDR RX Current Constant Receive, 2DH5, 3DH5 ‐ 41 ‐ mA Deep Sleep Current Deep Sleep Mode ‐ 70 ‐ µA Typ Max Unit ‐ 16 mA Table 9 Bluetooth Power Consumption DC Characteristics – General Purpose
PAGE 14
TiWi5 TRANSCEIVER MODULE DATASHEET WLAN RF Characteristics WLAN Transmitter Characteristics 2.4 GHz (TA=25°C, VBAT=3.6 V) Test Conditions Typ EVM Min Typ Max Unit 11 Mbps CCK (802.11b) TX Output Power 11 Mbps CCK , 802.11(b) Mask Compliance, 35% EVM RMS power over TX packet 1.1 ‐ 18.3 ‐ dBm 9 Mbps OFDM (802.11g) TX Output Power 9 Mbps OFDM , 802.11(g) Mask Compliance, ‐8 dB EVM RMS power over TX packet ‐24 ‐ 18.0 ‐ dBm 54 Mbps OFDM (802.11g) TX Output Power 54 Mbps OFDM, 802.
PAGE 15
TiWi5 TRANSCEIVER MODULE DATASHEET Table 12 WLAN 5 GHz Transmitter RF Characteristics WLAN Receiver Characteristics 2.4 GHz (TA=25°C, VBAT=3.6 V) [1] Parameter Test Conditions Min Typ Max Unit 1 Mbps CCK (802.11b) RX Sensitivity 8% PER ‐ ‐97 ‐ dBm 11 Mbps CCK (802.11b) RX Sensitivity 8% PER ‐ ‐88 ‐ dBm 9 Mbps OFDM (802.11g) RX Sensitivity 10% PER ‐ ‐89 ‐ dBm 54 Mbps OFDM (802.11g) RX Sensitivity 10% PER ‐ ‐74 ‐ dBm 6.5 Mbps OFDM (802.
PAGE 16
TiWi5 TRANSCEIVER MODULE DATASHEET MCS7 65 Mbps (802.11a) RX Sensitivity 10% PER ‐ ‐70 ‐ dBm Max Input Level (3) OFDM (11a or 11n) <10% PER ‐ ‐ ‐17 dBm Table 14 5 GHz WLAN Receiver RF Characteristics The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 17
TiWi5 TRANSCEIVER MODULE DATASHEET Bluetooth RF Characteristics Bluetooth Transmitter GFSK and EDR Characteristics, Class 1.5 (TA=25°C, VBAT=3.6 V) Test Conditions Parameter Min Typ Max Bluetooth Spec Unit GFSK RF Output Power ‐ 9.5 ‐ ‐ dBm EDR RF Output Power ‐ 7.3 ‐ Power Control Step Size 2 5 8 2‐8 dB EDR Relative Power ‐2 1 ‐4/+1 dB dBm Table 15 Bluetooth Transmitter RF Characteristics Bluetooth Receiver Characteristics (TA=25°C, VBAT=3.
PAGE 18
TiWi5 TRANSCEIVER MODULE DATASHEET Bluetooth Low Energy RF Characteristics Bluetooth BLE Transmitter GMSK and EDR Characteristics, Class 1.5 (TA=25°C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max Bluetooth Spec Unit GMSK RF Output Power ‐ 10 ‐ ‐ dBm Power Control Step Size 2 5 8 2‐8 dB (1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS command.
PAGE 19
TiWi5 TRANSCEIVER MODULE DATASHEET WLAN POWER‐UP SEQUENCE The following sequence describes device power‐up from shutdown. Only the WLAN Core is enabled; the Bluetooth and FM cores are disabled. Figure 3 TiWi5 Power‐up Sequence Requirements 1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'failsafe’. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC. 2.
PAGE 20
TiWi5 TRANSCEIVER MODULE DATASHEET – Firmware initialization The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 21
TiWi5 TRANSCEIVER MODULE DATASHEET WLAN POWER‐DOWN SEQUENCE Notes: 1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 2. DC_REQ and CLK_REQ are internal signals shown for reference only Figure 4 TiWi5 Module Power‐down Sequence Requirements 1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g BT) it will stay high. 2. CLK_REQ will go low only if WLAN is the only core working.
PAGE 22
TiWi5 TRANSCEIVER MODULE DATASHEET BLUETOOTH POWER‐UP SEQUENCE The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled; the WLAN core is disabled. Notes: 1. (A) After this sequence is completed, the device is in the low VIO‐leakage state while in shutdown 2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only Figure 5 Bluetooth Power‐up Sequence Power up requirements: 1.
PAGE 23
TiWi5 TRANSCEIVER MODULE DATASHEET BLUETOOTH POWER‐DOWN SEQUENCE Notes: 1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 2. DC_REQ and CLK_REQ are internal signals shown for reference only Figure 6 Bluetooth Power‐down Sequence The TiWi5 module indicates completion of Bluetooth power‐up sequence by asserting HCI_RTS low. This occurs up to 100 ms after BT_EN goes high. The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 24
TiWi5 TRANSCEIVER MODULE DATASHEET ENABLE SCHEME The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2 modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI commands. 1. Each core is operated independently by asserting each EN signal to Logic '1'.
PAGE 25
TiWi5 TRANSCEIVER MODULE DATASHEET SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital signal in the range of VIO only. For slow clock frequency and accuracy refer to Table 19. The external slow clock must be stable before the system exits from shut down mode.
PAGE 26
TiWi5 TRANSCEIVER MODULE DATASHEET BLUETOOTH HCI UART Figure 7 Bluetooth UART Timing Table 20 Bluetooth UART Timing The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 27
TiWi5 TRANSCEIVER MODULE DATASHEET Figure 8 Bluetooth UART Data Frame Table 21 Bluetooth UART Data Frame The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 28
TiWi5 TRANSCEIVER MODULE DATASHEET SDIO INTERFACE TIMING Table 22 SDIO Interface Read (see Figure 9) Figure 9 SDIO Single Block Read Table 23 SDIO Interface Write (see Figure 10) Figure 10 SDIO Single Block Write The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 29
TiWi5 TRANSCEIVER MODULE DATASHEET SDIO CLOCK TIMING Table 24 SDIO Timing Figure 11 SDIO Timing The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 30
TiWi5 TRANSCEIVER MODULE DATASHEET SOLDERING RECOMMENDATIONS Recommended Reflow Profile for Lead Free Solder Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See IPC‐A‐610‐D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.” Figure 12 Reflow Profile The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 31
TiWi5 TRANSCEIVER MODULE DATASHEET CLEANING SHIPPING, HANDLING, AND STORAGE In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. Shipping    Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads.
PAGE 32
TiWi5 TRANSCEIVER MODULE DATASHEET Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 33
TiWi5 TRANSCEIVER MODULE DATASHEET AGENCY CERTIFICATIONS FCC ID: TFB‐TIWI501 IC ID: 5969A‐TIWI501 CE: Compliant to standards EN 60950‐1, EN 300 328, EN 301 489, and EN 301 893 AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
PAGE 34
TiWi5 TRANSCEIVER MODULE DATASHEET FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. The following device approved under 15.407(b)(4)(ii) may be marketed, sold and imported until March 2, 2020. After this date these devices must comply with the emission limits of 15.407. The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 35
TiWi5 TRANSCEIVER MODULE DATASHEET Industry Canada Statements Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
PAGE 36
TiWi5 TRANSCEIVER MODULE DATASHEET L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil.
PAGE 37
TiWi5 TRANSCEIVER MODULE DATASHEET OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The TiWi5 Module has been certified for integration into products only by OEM integrators under the following conditions: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co‐located with any other transmitters except in accordance with FCC and Indus
PAGE 38
TiWi5 TRANSCEIVER MODULE DATASHEET the module is installed must display a label referring to the enclosed module. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: TFB‐TIWI501” “Contains Transmitter Module IC: 5969A‐TIWI501” or “Contains FCC ID: TFB‐TIWI501” “Contains IC: 5969A‐TIWI501” The OEM of the TiWi5 Module must only use the approved antenna(s) listed above, which have been certified with this module.
PAGE 39
TiWi5 TRANSCEIVER MODULE DATASHEET OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.
PAGE 40
TiWi5 TRANSCEIVER MODULE DATASHEET EUROPE CE Notice This device has been tested and certified for use in the European Union. See the Declaration of Conformity (DOC) for specifics. If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and Telecommunications Terminal Equipment (R&TTE) Directive.
PAGE 41
TiWi5 TRANSCEIVER MODULE DATASHEET MECHANICAL DATA Figure 13 Module Mechanical Dimensions (Maximum Module Height = 1.9mm) The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 42
TiWi5 TRANSCEIVER MODULE DATASHEET PCB FOOTPRINT Figure 14 TiWi5 Recommended PCB Footprint (Top View) The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 43
TiWi5 TRANSCEIVER MODULE DATASHEET TAPE AND REEL SPECIFICATION Figure 15 TiWi5 Tape and Reel Specification The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 44
TiWi5 TRANSCEIVER MODULE DATASHEET DEVICE MARKINGS Rev 1 Devices WL1273L: WL1273LYFVR PG3.32 Front End: TQP6M9002  Pre‐production devices. L S RESEARCH T iWi5 450 -0053 2D Bar Code 1- XXXXXX Where 1 = Revision X X X X X X= incremental serial number 2D B arc ode Format is Data Matrix S tandard Rev 2 Devices WL1273L: WL1273LYFVR PG3.32 Front End: TQP6M9002     LSR logo changed from red to black. Added FCC and IC numbers to the label. Revision number is no longer part of the serial number.
PAGE 45
TiWi5 TRANSCEIVER MODULE DATASHEET Rev 3 Devices WL1273L: WL1273LYFVR PG3.32 Front End: TQP6M9002  Incorporated PCB DFM improvements. L S RESEARCH XXXXXX Model: TiWi 5 P/N: 450-0053 FCC: TFB- TIWI501 IC: 5969A-TIWI 501 REV 3 2D Bar Code Where 3 = Revision X X X X X X= incremental serial number 2D B arc ode Format is Data Matrix S tandard The information in this document is subject to change without notice. 330‐0042‐R2.
PAGE 46
TiWi5 TRANSCEIVER MODULE DATASHEET CONTACTING LS RESEARCH Headquarters LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012‐2636 USA Tel: (262) 375‐4400 Fax: (262) 375‐4248 Website www.lsr.com Wiki http://www.lsr.com/products‐wiki Technical Support http://www.lsr.com/products‐forum Sales Contact sales@lsr.com © Copyright 2016 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and reliable.