User Manual

TiWi-BLE TRANSCEIVER MODULE
DATASHEET
The information in this document is subject to change without notice.
330-0087-R2.1 Copyright © 2011-2013 LS Research, LLC Page 26 of 40
SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
Figure 12 Reflow Profile