User's Manual
Table Of Contents
- Scope
- SSD50NBT Features Summary
- Specifications
- WLAN Functional Description
- Bluetooth Functional Description
- Electrical Characteristics
- Bluetooth Radio Characteristics
- SDIO Timing Requirements
- Pin Definitions
- Boot Straps Options for Wi-Fi Interface
- Mechanical Specifications
- RF Layout Design Guidelines
- Recommended Storage, Handling, Baking, and Reflow Profile
- Regulatory
- FCC and IC Regulatory
- European Union Regulatory
- EU Declarations of Conformity
- Ordering Information
SSD50NBT
Hardware Integration Guide
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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Two-side components platform:
– Use two hot air guns
– On the bottom side, use a pre-heated nozzle (temperature setting of 200~250°C) at a suitable
distance from the platform PCB.
– On the top side, apply a remove nozzle (temperature setting of 330°C). Heat the SIP until it can be
removed from platform PCB.
Remove the residue solder under the bottom side of SIP.
(Not accepted for RMA) (Accepted for RMA analysis)
SIP with residue solder on the bottom SIP without residue solder on the bottom
Remove and clean the residue flux if needed.
Platform
PCB
SIP
Remove Nozzle
Pre-heat
Nozzle
