User's Manual
Table Of Contents
- Scope
- SSD50NBT Features Summary
- Specifications
- WLAN Functional Description
- Bluetooth Functional Description
- Electrical Characteristics
- Bluetooth Radio Characteristics
- SDIO Timing Requirements
- Pin Definitions
- Boot Straps Options for Wi-Fi Interface
- Mechanical Specifications
- RF Layout Design Guidelines
- Recommended Storage, Handling, Baking, and Reflow Profile
- Regulatory
- FCC and IC Regulatory
- European Union Regulatory
- EU Declarations of Conformity
- Ordering Information
SSD50NBT
Hardware Integration Guide
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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Figure 9: Temperature Profile
Cautions When Removing the SIP from the Platform for RMA
Bake the platform before remove the SIP from the platform. Reference baking conditions.
Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician.
Suggestion conditions:
One-side component platform:
– Set the hot plate at 280°C.
– Put the platform on the hot plate for 8~10 seconds.
– Remove the SIP from platform.