User's Manual

SSD50NBT
Hardware Integration Guide
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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Temporary Storage Requirements after Opening
The following are temporary storage requirements after opening:
 Only re-store the devices once prior to soldering.
 Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing
again using heat-sealing.
The following indicate the required storage period, temperature, and humidity for this temporary storage:
Storage temperature and humidity
*** - External atmosphere temperature and humidity of the dry packing
Storage period
– X1+X2 – Refer to After Opening the Dry Packing storage requirements.
– Y – Two weeks or less.
Baking Conditions
Baking conditions and processes for the SSD50NBT follow the J-STD-033 standard which includes the following:
 The calculated shelf life in a sealed bag is 12 months at <40℃ and <90% relative humidity.
 Once the packaging is opened, the SiP must be mounted (according to MSL3/Moisture Sensitivity Level 3)
within 168 hours at <30℃ and <60% relative humidity.
 If the SiP is not mounted within 168 hours or if, when the packaging is opened, the humidity indicator card
displays >10% humidity, then the product must be baked for 48 hours at 125℃ (±5℃).
Surface Mount Conditions
The following soldering conditions are recommended to ensure device quality.
Soldering
Note: When soldering, the stencil thickness should be ≥ 0.1 mm.
Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen
environment)
 Measuring point – IC package surface
 Temperature profile:
Temperature: 5-40°C
Humidity: 80% or less
Temperature: 5-25°C
Humidity: 60% or less
Temperature: 5-40°C
Humidity: 80% or less
Temperature: 5-25°C
Humidity: 60% or less
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