User's Manual
Table Of Contents
- Scope
- SSD50NBT Features Summary
- Specifications
- WLAN Functional Description
- Bluetooth Functional Description
- Electrical Characteristics
- Bluetooth Radio Characteristics
- SDIO Timing Requirements
- Pin Definitions
- Boot Straps Options for Wi-Fi Interface
- Mechanical Specifications
- RF Layout Design Guidelines
- Recommended Storage, Handling, Baking, and Reflow Profile
- Regulatory
- FCC and IC Regulatory
- European Union Regulatory
- EU Declarations of Conformity
- Ordering Information
SSD50NBT
Hardware Integration Guide
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
Figure 8: Pad dimensions and pin numbers
Recommend minimal via size and placement for grounding and thermal dissipation. Please double the ground
via number when using laser via on HID process. More ground via and using 1-oz copper is recommended in our
design to get better thermal dissipation.
Note: When soldering, the stencil thickness should be ≥ 0.1 mm.
RF LAYOUT DESIGN GUIDELINES
The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your
device.
Do not run antenna cables directly above or directly below the radio.
Do not place any parts or run any high speed digital lines below the radio.
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