User's Manual

Laird SSD45N
Hardware Integration Guide, version 0.01
Rework is technically challenging due to parts on the SIP reflowing at the same temperature
needed for rework. The SDC-SSD45N cannot be lifted by the shield during rework. As such,
removal of part for rework is not recommended. Reflow without removal has been successfully
used to clear shorts found during x-ray inspection.
Reflow: The SDC-SSD45N is RoHS compliant and as such is sensitive to heat. The below graphic
details a typical profile for such and device and is provided for reference purposes.
Recommendations:
If the SSD45N has been removed from the moisture-protective packaging for more than 24 hours,
bake at 125 degrees Celsius for 24 hours (per Jedec-STD-033). This is a preparatory step prior to
reflow to ensure that the SIPs are sufficiently dehydrated. Reflow should occur immediately
following baking to prevent rehydration.
• It is recommended that the peak temperature at the solder joint be within 240°C ~ 250°C and the
maximum component temperature should not exceed 250°C.
• It is recommended that time above 220°C for the solder joints is between 60-80s, and with a
minimum of 50s.
• Excessive ramp/cooling rates (>3°C/s) should be avoided.
To develop the reflow profile, it is recommended that the user place thermocouples at various locations
on the assembly to confirm that all locations meet the profile requirements. The critical locations are the
solder joints of SiP Module.
When developing the reflow profile, it is recommended that the actual fully loaded assembly be used to
make sure that the total thermal mass is accounted for.
Americas: [phone] Option 2
Europe: [phone]
Hong Kong: [phone] x026
www.lairdtech.com/wireless
22 Laird Technologies