User's Manual

Laird SSD45N
Hardware Integration Guide, version 0.01
Recommend footprint (TOP view)
Solder Stencil Opening for Pads (56 signal pads): 1:1 to 1:0.9 (dependent on solder type)
Solder Stencil Opening for Thermal Pads (9 “window pane” pads): 1:0.5 to 1:0.75 (dependent on
solder type)
Note: The ground vias that are in the thermal pad (6x6 pattern of 12 mil holes) are open; they
are not tented by the solder mask on the bottom side. This allows excess paste to
escape from the bottom side to help ensure a flat SIP installation.
Solder Paste Type: No-Clean as the soldered part to board clearance will not allow for
adequate post solder cleaning.
Americas: [phone] Option 2
Europe: [phone]
Hong Kong: [phone] x026
www.lairdtech.com/wireless
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