User's Manual
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ORDERING INFORMATION
- MODULE ACCESSORIES
- BLOCK DIAGRAM
- DEVELOPMENT KIT
- MODULE PINOUT AND PIN DESCRIPTIONS
- MODULE OVERVIEW
- OPERATING MODES TRUTH TABLE
- MODES OF OPERATION
- DEVELOPMENT TOOLS
- ELECTRICAL SPECIFICATIONS
- SOLDERING RECOMMENDATIONS
- CLEANING
- OPTICAL INSPECTION
- REWORK
- SHIPPING, HANDLING, AND STORAGE
- AGENCY STATEMENTS
- MECHANICAL DATA
- COMPATIBILITY
- MODULE REVISION HISTORY
- CONTACTING LS RESEARCH
SiFLEX02-HP TRANSCEIVER MODULE
DATASHEET
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 5 of 35
RF Characteristics .................................................................................................................................... 21
SOLDERING RECOMMENDATIONS ................................................................................ 24
Recommended Reflow Profile for Lead Free Solder ............................................................................. 24
CLEANING ......................................................................................................................... 25
OPTICAL INSPECTION ..................................................................................................... 25
REWORK ........................................................................................................................... 25
SHIPPING, HANDLING, AND STORAGE ......................................................................... 25
Shipping ..................................................................................................................................................... 25
Handling ..................................................................................................................................................... 25
Moisture Sensitivity Level (MSL) ............................................................................................................. 25
Storage ....................................................................................................................................................... 25
Repeating Reflow Soldering .................................................................................................................... 25
AGENCY STATEMENTS ................................................................................................... 26
MECHANICAL DATA......................................................................................................... 32
PCB Footprint .................................................................................................. Error! Bookmark not defined.
General Module Dimensions .................................................................................................................... 32
COMPATIBILITY ................................................................................................................ 33
MODULE REVISION HISTORY ......................................................................................... 34
Rev 1.1 ........................................................................................................................................................ 34
CONTACTING LS RESEARCH ......................................................................................... 35