User's Manual

Table Of Contents

SiFLEX02 TRANSCEIVER MODULE

MODULE USER’S GUIDE

5.5 Carrier Board Alignment Holes

The ModFLEX modules have two 0.032” diameter non-plated holes in the PCB that can

be used to align the module to the carrier board. When designing the carrier board it is

recommended to include two matching alignment holes with copper pads surrounding

the holes on the bottom side of the board. The purpose of the copper pads allows for

soldering alignment pins when the carrier board is used as an alignment fixture, which is

described in the following sections.

Figure 12 Alignment holes on module and carrier board

The information in this document is subject to change without notice.

Confirm the data is current by downloading the latest revision from www.lsr.com.