A Hardware Integration Guide LoRa/Bluetooth Low Energy (BLE) Module Part Numbers: RM186 and RM191 Preliminary Version 0.
LoRa/BLE Modules Hardware Integration Guide REVISION HISTORY Version 0.01 Date 28 Mar 2016 Notes Preliminary Release Approver Jonathan Kaye 0.02 31 Mar 2016 Deleted Note 3 for power supply rise time in section ”Recommended Operating Parameters” Modified section “FCC and IC Regulatory Statements“ John Talley 0.03 28 April 2016 Jonathan Kaye 0.04 29 April 2016 Updated Max Transmit power, temperatures, and DVK descriptions. Update to IC Radiation Exposure Statement, Operating temperatures.
LoRa/BLE Modules Hardware Integration Guide CONTENTS Overview and Key Features ........................................................................................................................................5 Features and Benefits .............................................................................................................................................5 Application Areas................................................................................................................
LoRa/BLE Modules Hardware Integration Guide Reflow Parameters .............................................................................................................................................. 29 FCC and IC Regulatory Statements .......................................................................................................................... 31 Power Exposure Information.......................................................................................................................
LoRa/BLE Modules Hardware Integration Guide OVERVIEW AND KEY FEATURES This Hardware Integration Guide describes both the RM186 (868MHz band for EU) and RM191 (915MHz band for US). The differences will be outlined in the Radio Specifications. Every RM1xx Series module is designed to enable OEMs to add a long range LoRa radio link as well as central role Bluetooth Low Energy (BLE) to small, portable, power-conscious devices.
LoRa/BLE Modules Hardware Integration Guide SPECIFICATIONS Table 1: Specifications Categories LoRa Wireless Specification Feature Implementation LoRa® LoRaWAN 1.01 (End Device) Frequency Maximum Transmit Power Setting BLE Wireless Specification RM191 865-870 MHz RM186 15.5 dBm RM191 13.5 dBm RM186 Minimum Transmit Power Setting 1.
LoRa/BLE Modules Hardware Integration Guide Categories Feature Implementation From 1,200 to 460800 bps GPIO Up to 14 With configurable I/O direction, O/P drive strength (standard 0.5 mA or high 5 mA), pull-up/pull-down ADC Four 10-bit channels (including ADC reference) 10 bit resolution 1.
LoRa/BLE Modules Hardware Integration Guide Categories Physical Feature Implementation Dimensions 25.4 mm x 25.4 mm x 3.1 mm Weight 3 grams Operating -40 ˚C to +85 ˚C (VCC 1.8V – 3.
LoRa/BLE Modules Hardware Integration Guide HARDWARE SPECIFICATIONS Block Diagram and Pin-out Figure 1: Functional HW and SW block diagram for RM1xx series smartBASIC modules Figure 2: RM186/RM191 module pin-out (top view) Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless 9 © Copyright 2016 Laird.
LoRa/BLE Modules Hardware Integration Guide Pin Definitions Table 2: Pin definitions Pin # Pin Name Default Function Alt. Funct.
LoRa/BLE Modules Hardware Integration Guide Note 1: Secondary function is selectable in smartBASIC application. Note 2: DIO = Digital Input or Output. I/O voltage level tracks VCC. Note 3: AIN = Analog Input Note 4: DIO or AIN functionality is selected using the GpioSetFunc() function in smartBASIC. Note 5: AIN configuration selected using GpioSetFunc() function. Note 6: I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC.
LoRa/BLE Modules Hardware Integration Guide the setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected externally as per I2C standard. UART_RX, UART_TX, UART_CTS are Vcc logic levels (if VCC is 3.3 V, i.e. SIO pin I/O levels track VCC). For example, when RX and TX are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, handshaking pins CTS and RTS at 0 V are treated as assertions.
LoRa/BLE Modules Hardware Integration Guide Table 5: Signal Levels for Interface, SIO Parameter VIH Input high voltage VIL Input low voltage VOH Output high voltage (std. drive, 0.5mA) (high-drive, 5mA) (Note 1) VOL Output low voltage (std. drive, 0.5mA) (high-drive, 5mA) (Note 1) Pull up resistance Pull down resistance Minimum 0.7VCC Typical Maximum VCC Unit V VSS 0.3 V VCC-0.3 VCC-0.3 VCC VCC V V VSS VSS 0.3 0.3 V V 16 16 kΩ kΩ Maximum +1.
LoRa/BLE Modules Hardware Integration Guide Note 1: Stay within internal 1.2 V reference voltage with given prescaling on AIN pin and do not violate ADC maximum input voltage (for damage) for a given VCC, e.g. If VCC is 1.8 V can only expose AIN pin to 2.1 V (VCC+0.3). Note 2: Currently, the smartBASIC runtime engine firmware only allows 10-bit mode. Note 3: ADC input impedance is estimated mean impedance of the ADC (AIN) pins. The tolerance is +/-20%.
LoRa/BLE Modules Hardware Integration Guide LORA POWER CONSUMPTION Data taken at VCC 3.3V with DCDC converter ON (see Note1) at 25ºC. All peripherals turned off except for UART. Table 8: Power consumption Parameter RM191 TX Currents TX current @TXpwr= +15 dBm TX current @TXpwr= 1 dBm RM186 TX Currents TX current @TXpwr= 13.5dBm TX current @TXpwr= 1 dBm RM1xx Receive Current RX current Note 1: Min Typical Max Unit 50 TBD mA mA 38 TBD mA mA 13 mA At VCC = 3.3V, the DCDC converter will be active.
LoRa/BLE Modules Hardware Integration Guide Parameter Active Mode Average current (Note 4) Min Connection Average Current draw Max with connection interval (min) 7.5 mS with connection interval 67.5 mS Min with connection interval (max) 4000 mS Typical ~400 ~2.6-4.1 Max Unit uA uA Note 1: If VCC reduces to 2.1V (operating range of DCDC), the peak current consumption would increase from 11.6mA to ~15.5mA for TX power setting of +3dBm. Note 2: RM1xx: Standby Doze current TBD typical.
LoRa/BLE Modules Hardware Integration Guide BLE Measured Peak Current Waveforms during Connection The following figures illustrate BLE current waveforms observed as the RM1xx module performs during connection functionality. TBD: Update plot Figure 3: Typical peak current consumption profile with TBD conditions Note: In the above picture, UART is ON. X-axis time (1 mS per square), Y-axis current (2 mA per square).
LoRa/BLE Modules Hardware Integration Guide Table 13: ADC Power Consumption Parameter ADC current during conversion Min Typ 260 Max Unit uA For asynchronous interface like the UART (asynchronous as the other end can communicate at any time), the UART (on RM1xx) must kept open (by a command in smart BASIC application script) resulting in the base current consumption penalty.
LoRa/BLE Modules Hardware Integration Guide Clocks and Timers Clocks The integrated high accuracy (+/-20 ppm) 32.768 kHz crystal oscillator provides protocol timing and helps with radio power consumption in the system Standby Doze/Deep sleep modes by reducing the time that the RX window needs to be open. Standard accuracy clocks tend to have lower accuracy +/-250 ppm.
LoRa/BLE Modules Hardware Integration Guide These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS, UART_RTS are all CMOS logic levels that track VCC. For example, when RX and TX are idle they sit at a high logic level (VCC). Conversely for handshaking pins CTS, RTS at 0 V is treated as an assertion.
LoRa/BLE Modules Hardware Integration Guide Table 15: Peripheral supports Signal Name SPI_MOSI Pin # 17 I/O O SPI_MISO 16 I SPI_CLK 15 O Comments This interface is an alternate function configurable by smart BASIC. Default in the FW pin 15 and 17 are inputs. SPIOPEN() in smart BASIC selects SPI function and changes pin14 and 16 to outputs (when in SPI master mode). I2C Interface The I2C interface is an alternate function on SIO pins, configurable by smart BASIC command.
LoRa/BLE Modules Hardware Integration Guide PWM and FREQ Signal Output on up to Two SIO Pins The PWM and FREQ output is an alternate function on SIO pins, configurable by smart BASIC. The ability to output a PWM (Pulse Width Modulated) signal or FREQ output signal on up to 2 GPIO (SIO) output pins can be selected using GpioSetFunc() function. PWM output signal has a frequency and duty cycle property. PWM output is generated using 32-bit hardware timers. The timers are clocked by a 1MHz clock source.
LoRa/BLE Modules Hardware Integration Guide VCC_IO 1 3 5 7 9 JP1 2 4 6 8 10 nRESET/SWDIO SWDCLK (RM1xx Pin 22) (RM1xx Pin 23) FTSH-105 GND Figure 5: Wiring for 2-Wire SWD Programming/Debug Interface connector to SWD Programming/Debug interface on RM1xx module RM1xx on-board chip antenna characteristics The RM1xx on-board chip monopole antenna radiated performance depends on the host PCB layout. RM1xx development board was used for RM1xx development and antenna performance evaluation.
LoRa/BLE Modules Hardware Integration Guide lowers the AIN voltage. However, when the capacitor is connected it should keep the AIN voltage at previous level for an adequate time period while sampling, minimizing the effect of the high resistance value of the external voltage divider. The capacitor should be big enough to hold voltage up for the required time period, i.e. 20 us for 8 bit sampling or 68 us for 10 bit sampling.
LoRa/BLE Modules Hardware Integration Guide PCB Layout on Host PCB - General Checklist (for PCB): MUST locate RM1xx module close to the edge of PCB (mandatory for RM1xx for on-board chip antenna to radiate properly). Use solid GND plane on inner layer (for best EMC and RF performance). All module GND pins MUST be connected to host PCB GND. Place GND vias close to module GND pads as possible.
LoRa/BLE Modules Hardware Integration Guide Figure 6: Antenna keepout on DVK-RM1xx PCB (shown in red) with RM1xx module placed near the corner. Note: 1. RM1xx module placed on edge of host PCB (close to the corner of the PCB). 2. Copper cut-away on all layers in “antenna Keep-out” for a host PCB.
LoRa/BLE Modules Hardware Integration Guide LoRa External Antenna Integration with RM1xx Please refer to the regulatory sections for FCC/IC, and CE, for details of use of RM1xx with external antennas. The RM1xx has been designed to operate with the below external antennas (with a maximum gain of 2dBi). The required antenna impedance is 50 ohms. See Table 19. Table 19: LoRa External antennas for the RM1xx External Antenna Part Number RFDPA131015IMBB301 Laird Part Number TBD Mfg.
LoRa/BLE Modules Hardware Integration Guide Host PCB Land Pattern and Antenna Keep-out for RM1xx Application Notes 1. Ensure there is no copper in the antenna ‘keep out area’ on any layers of the host PCB. Also keep all mounting hardware or any metal clear (Refer to 0) on of the area to reduce effects of proximity detuning the antenna and to help antenna radiate properly. 3.
LoRa/BLE Modules Hardware Integration Guide Manual. This Application Note is considered a living document and will be updated as new information is presented. The modules are designed to meet the needs of a number of commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes. Shipping Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and place machines.
LoRa/BLE Modules Hardware Integration Guide Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in in Table 20, the modules must be removed from the shipping tray. Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment 30°C/60%RH.
LoRa/BLE Modules Hardware Integration Guide Specification Value Unit Soak Temp Increase rate (goal) Flux Soak Period (Min) .
LoRa/BLE Modules Hardware Integration Guide External Antenna Part Number RFDPA131015IMBB301 Laird Part Number TBD Mfg. Type Dipole Gain (dBi) 0.9 Connector Type U.FL RM1xx Part number RM191-SM Walsin WPANTDP036-R5A - World Products Dipole 2.0 U.FL RM191-SM S152CL-L-PX-915S - Nearson Dipole 2.0 U.FL RM191-SM Note: For the LoRa (external) dipole antenna, the OEM is free to choose another vendor’s antenna of like type and equal or lesser gain (2dBi) and still maintain compliance.
LoRa/BLE Modules Hardware Integration Guide Label and text information should be in a size of type large enough to be readily legible, consistent with the dimensions of the equipment and the label. However, the type size for the text is not required to be larger than eight point. CAUTION: The OEM should have their device which incorporates the RM191-SM tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators.
LoRa/BLE Modules Hardware Integration Guide REMARQUE IMPORTANTE Déclaration IC d'exposition aux radiations Pour se conformer à Industrie Canada RF limites d'exposition pour la population générale / exposition non contrôlée, l'antenne utilisée pour ce transmetteur doit être installée pour fournir une distance d'au moins 30 mm de toutes les personnes et ne doit pas fonctionner en conjonction avec toute autre antenne ou transmetteur.
LoRa/BLE Modules Hardware Integration Guide Antenna Information The external flying lead U.FL dipole antennas for the 868MHz LoRa radio listed below were tested for use with the RM186. For CE mark countries, the OEM is free to use any manufacturer’s antenna and type of antenna as long as the gain is less than or equal to the highest gain approved for use (2.0dBi) Contact a Laird Technologies representative for more information regarding adding antennas.
LoRa/BLE Modules Hardware Integration Guide EU DECLARATIONS OF CONFORMITY RM186-SM Manufacturer: Laird Product: RM186-SM EU Directive: RTTE 1995/5/EC Conformity Assessment: Annex IV Reference standards used for presumption of conformity: Article Number 3.1a Requirement Health and Safety Reference standard(s) EN60950-1:2006+A11:2009+A1:2010+A12:2011 Protection requirements with respect to electromagnetic compatibility EN 301 489-1 V1.9.2 (2011-09) EN 301 489-17 V2.2.
LoRa/BLE Modules Hardware Integration Guide ORDERING INFORMATION Part Number RM186-SM Description Intelligent LoRa/BLE Module [868MHz LoRa for Europe] featuring smart BASIC RM191-SM DVK – RM186-SM Intelligent LoRa/BLE Module [915MHz LoRa for US] featuring smart BASIC Development board with RM186-SM module soldered in place DVK – RM191-SM Development board with RM191-SM module soldered in place General Comments This is a preliminary datasheet.
LoRa/BLE Modules Hardware Integration Guide Note: Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG invoice is paid. 5. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document accessible from the site. Your new design will be listed on the SIG website and you can print your Certificate and DoC. For further information please refer to the following training material: https://www.bluetooth.
LoRa/BLE Modules Hardware Integration Guide Examples of LL components that can be combined into a new design are: Listing reference Design Name Core Spec Version TBD nRF51xxx stack: S110 link layer 4.0 TBD Sx20_nRF51xxx link layer 4.1 TBD S130_nRF51xxx link layer 4.2 *Note: Please check with Laird/Nordic for applicable LL components.
