User's Manual

BT900-Sx Hardware Integration Guide
Intelligent BTv4.0 Dual Mode Module
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www.lairdtech.com/bluetooth
40 CONN-HIG-BT900
Any modules not manufactured before exceeding their floor life should be re-packaged with
fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3
devices is 168 hours in ambient environment
≤ 30°C/60%RH.
Table 20: Recommended baking times and temperatures
MSL
125°C
Baking Temp.
90°C/≤ 5%RH
Baking Temp.
40°C/ ≤ 5%RH
Baking Temp.
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
3 9 hours 7 hours 33 hours 23 hours 13 days 9 days
Laird surface mount modules are designed to be easily manufactured, including reflow soldering
to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste
and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird
surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 8-2: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 21.
Table 21: Recommended Maximum and minimum temperatures
Specification Value Unit
Temperature Inc./Dec. Rate (max) 1~3 °C / Sec
Temperature Decrease rate (goal) 2-4 °C / Sec
Soak Temp Increase rate (goal) .5 - 1 °C / Sec
Flux Soak Period (Min) 70 Sec
Flux Soak Period (Max) 120 Sec
Flux Soak Temp (Min) 150 °C
Flux Soak Temp (max) 190 °C