User's Manual

BT900-Sx Hardware Integration Guide
Intelligent BTv4.0 Dual Mode Module
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www.lairdtech.com/bluetooth
39 CONN-HIG-BT900
8.2 Shipping
Figure 8-1: BT900 Shipping Tray Details
8.3 Reflow Parameters
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture
absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator
card to display the level maintained during storage and shipment. If directed to bake units on the
card, see Table 20 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this
standard is available from the JEDEC website:
http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher
temperatures displayed in in Table 20, the modules must be removed from the shipping
tray.
Modules are shipped in ESD
(Electrostatic Discharge) safe trays that
can be loaded into most
manufacturers pick and place
machines. Layouts of the trays are
provided in Figure 8-1.