User's Manual

BT860
Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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C ONTENTS
1 Scope ............................................................................................................................................................. 4
2 Operational Description ........................................................................................................................... 4
3 Block Diagram and Descriptions ............................................................................................................... 5
4 Specifications ........................................................................................................................................... 6
5 Pin Definitions .......................................................................................................................................... 6
6 DC Electrical Characteristics ..................................................................................................................... 8
7 RF Characteristics ..................................................................................................................................... 8
8 Interface .................................................................................................................................................. 9
8.1. Global Coexistence Interface .................................................................................................................... 9
8.2. UART Interface ....................................................................................................................................... 10
8.2.1. Simultaneous UART Transport and Bridging ........................................................................................... 10
8.3. PCM Interface ........................................................................................................................................ 11
8.3.1. Slot Mapping .......................................................................................................................................... 11
8.3.2. Frame Synchronization ........................................................................................................................... 12
8.3.3. Data Formatting ....................................................................................................................................... 15
8.3.4. Wideband Speech Support ..................................................................................................................... 16
8.3.5. Multiplexed Bluetooth Over PCM ................................................................................................................ 16
8.3.6. Burst PCM Mode .................................................................................................................................... 16
8.4. I
2
S Interface............................................................................................................................................ 18
8.5. BSC (Cypress Serial Control) Master Interface ......................................................................................... 20
9 Antenna Performance ............................................................................................................................ 21
10 Mechanical Dimensions and Land Pattern .............................................................................................. 23
11 Implementation Note ............................................................................................................................. 24
11.1. PCB Layout on Host PCB ......................................................................................................................... 24
12 Application Note for Surface Mount Modules ........................................................................................ 25
12.1. Introduction ........................................................................................................................................... 25
12.2. Shipping ................................................................................................................................................. 25
12.3. Reflow Parameters ................................................................................................................................. 27
13 Japan (MIC) Regulatory .......................................................................................................................... 28
14 FCC Regulatory ....................................................................................................................................... 29
15 Industry Canada Regulatory ................................................................................................................... 31
16 European Union Regulatory ................................................................................................................... 32
17 Ordering Information ............................................................................................................................. 33
18 Bluetooth SIG Approvals......................................................................................................................... 34
18.1. Application Note: Subsystem Combinations ........................................................................................... 34
19 Additional Assistance ............................................................................................................................. 35