User's Manual

Enhanced Class 1 Bluetooth v2.1 Module
User’s Guide
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Europe: [phone]
Hong Kong: [phone]
www.lairdtech.com/wireless
183
CONN-GUIDE-BT740_v0.2
15.3 Reflow Parameters
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure
oven temperatures during reflow meet the requirements of the solder paste. Laird’s surface mount
modules conform to J-STD-020D1 standards for reflow temperatures.
WARNING: During reflow, modules should not be above 260° for more than 30 seconds.
Figure 15-2: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 15-1.
Table 15-1: Recommended maximum and minimum temperatures
Specification
Value
Unit
Temperature Inc./Dec. Rate (max)
1~3
°C / Sec
Temperature Decrease rate (goal)
2-4
°C / Sec
Soak Temp Increase rate (goal)
.5 - 1
°C / Sec
Flux Soak Period (Min)
70
Sec
Flux Soak Period (Max)
120
Sec
Flux Soak Temp (Min)
150
°C
Flux Soak Temp (max)
190
°C
Time Above Liquidous (max)
70
Sec
Time Above Liquidous (min)
50
Sec
Time In Target Reflow Range (goal)
30
Sec
Time At Absolute Peak (max)
5
Sec
Liquidous Temperature (SAC305)
218
°C
Lower Target Reflow Temperature
240
°C
Upper Target Reflow Temperature
250
°C
Absolute Peak Temperature
260
°C