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TiWi-uB1 Module

DATASHEET

The information in this document is subject to change without notice.

TiWi-uB1 Bluetooth Smart (BLE) Module

FEATURES

 Built in CC2541 single-chip Bluetooth

Smart (BLE 4.0) System-On-Chip

(SOC).

 RF Output Power: 0 dBm (Class 3)

 RF Receive Sensitivity: -92 dBm

 Size: 11.6mm x 17.9 mm x 2.3 mm

 Operating Voltage: 2.0V to 3.6V

 Operating Temperature: -40 to +85

 Worldwide Acceptance: FCC (USA), IC

(Canada), and CE (Europe)

 REACH and RoHS compliant

 Complete power-optimized stack,

including Controller and Host

o GAP – Central, Peripheral,

Observer, or Broadcaster (Including

Combination Roles)

o ATT/GATT – Client and Server

o SMP – AES-128 Encryption and

Decryption

o L2CAP

 Multiple Configuration Options

o Single-Chip Configuration, Allowing

Applications to Run on CC2541

o Network Processor Interface for

Applications Running on an External

Microcontroller

APPLICATIONS

 2.4 GHz Bluetooth Low Energy Systems

 Human-Interface Devices (Keyboard,

Mouse, Remote Control)

 Sports and Leisure Equipment

 Mobile Phone Accessories

 Consumer Electronics

DESCRIPTION

LSR would like to announce a low-cost and low-

power consumption module which has all of the

BluetoothSmart functionalities.

The TiWi-uB1 module fully supports the single

mode Bluetooth Low Energy operation, and the

output power can support class 3. The module

provides the ability to either put your entire

application into the integrated 8051

microcontroller, or use the module in Network

Processor mode in conjunction with the

microcontroller of your choice.

Need to get to market quickly? Not an expert in

Bluetooth Low Energy? Need a custom

antenna? Do you need help with your host

board? LS Research Design Services will be

happy to develop custom hardware or software,

or help integrate the design. Contact us at

sales@lsr.com or call us at 262-375-4400.

Summary of content (22 pages)

PAGE 1
TiWi-uB1 Module DATASHEET TiWi-uB1 Bluetooth Smart (BLE) Module FEATURES           DESCRIPTION Built in CC2541 single-chip Bluetooth Smart (BLE 4.0) System-On-Chip (SOC). RF Output Power: 0 dBm (Class 3) RF Receive Sensitivity: -92 dBm Size: 11.6mm x 17.9 mm x 2.3 mm Operating Voltage: 2.0V to 3.
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TiWi-uB1 Module DATASHEET TABLE OF CONTENTS FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 FOOTPRINT AND PIN DEFINITIONS.........................................
PAGE 3
TiWi-uB1 Module DATASHEET Declaration of Conformity (DOC) ............................................................................................................ 21 BLUETOOTH CERTIFICATION ......................................................................................... 21 CONTACTING LS RESEARCH ......................................................................................... 22 The information in this document is subject to change without notice.
PAGE 4
TiWi-uB1 Module DATASHEET FOOTPRINT AND PIN DEFINITIONS 1 33 2 32 3 31 4 30 5 29 6 28 7 27 8 26 9 25 10 24 11 23 12 22 13 14 15 16 17 18 19 20 21 Figure 1 TiWi-uB1 Module Footprint (Viewed From Top) The information in this document is subject to change without notice.
PAGE 5
TiWi-uB1 Module DATASHEET PIN DESCRIPTIONS Module Pin Name I/O Type Description 1 RF OUT RF 2 GND GND GROUND 3 GND GND GROUND 4 OSC32K_Q1/P2_4 AI/DIO GENERAL PURPOSE DIGITAL I/O 5 OSC32K_Q2/P2_3 AI/DIO 32KHZ GENERAL PURPOSE DIGITAL I/O 6 /RESET DI 7 DC/P2_2 DI/DIO 8 DD/P2_1 DIO 9 NC - NO CONNECT (DO NOT CONNECT) 10 NC - NO CONNECT (DO NOT CONNECT) 11 AVCC PI ANALOG POWER SUPPLY TO MODULE (2.0V – 3.6V) 12 DVCC PI DIGITAL POWER TO SUPPLY MODULE (2.0V – 3.
PAGE 6
TiWi-uB1 Module DATASHEET ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Symbol Description Min Max Unit DVCC Digital Input Supply Voltage -0.3 3.9 V AVCC Analog Input Supply Voltage -0.3 3.9 V Voltage on any digital pin -0.3 VDD + 0.3 ≤ 3.9 V VDIO Table 2 Absolute Maximum Ratings 1 Recommended Operating Conditions Test conditions: Ambient Temp = 25°C Symbol VCC Min Typ 2.0 3.3 Table 3 Recommended Operating Conditions Max Unit 3.
PAGE 7
TiWi-uB1 Module DATASHEET General Specifications Measured on LSR TiWi-uB1 EM reference design with TA = 25°C and VDD = 3 V Parameter Test Conditions Min Typ Max Unit WAKE-UP AND TIMING Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC 4 µS Power mode 1 → Active Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16MHz RCOSC 120 µS Power mode 2 or 3 → Active Crystal ESR = 16 Ω.
PAGE 8
TiWi-uB1 Module DATASHEET Current Consumption Measured on LSR TiWiuB1 EM reference design with TA = 25°C, VDD = 3 V, fc = 2440 MHz. LEDs disabled, DC to DC disabled Mode Icore Core current consumption Description Average Current RX mode, standard mode, no peripherals active, low MCU activity 17.9 RX mode, high-gain mode, no peripherals active, low MCU activity 20.2 TX mode, –20 dBm output power, no peripherals active, low MCU activity 16.
PAGE 9
TiWi-uB1 Module DATASHEET RF Characteristics Measured on LSR TiWiuB1 EM reference design with TA = 25°C, VDD = 3 V, fc = 2440 MHz. LEDs disabled, DC to DC disabled, measured at RF connecter.
PAGE 10
TiWi-uB1 Module DATASHEET SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS Two 32-kHz oscillators are available in the device as clock sources for the 32-kHz clock: • 32-kHz XOSC – External Crystal Oscillator • 32-kHz RCOSC – Internal RC Oscillator By default, after a reset, the 32-kHz RCOSC is enabled and selected as the 32-kHz clock source. The RCOSC consumes less power, but is less accurate compared to the 32-kHz XOSC.
PAGE 11
TiWi-uB1 Module DATASHEET 32-kHz INTERNAL RC OSCILLATOR Characteristic Condition Min Calibrated frequency (1) Typ Max 32768 Frequency accuracy after calibration -40 Unit Hz 40 ppm Temperature coefficient(2) ±0.
PAGE 12
TiWi-uB1 Module DATASHEET SPI INTERFACE CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.
PAGE 13
TiWi-uB1 Module DATASHEET Figure 2 SPI Master Timing Figure 3 Slave Timing The information in this document is subject to change without notice.
PAGE 14
TiWi-uB1 Module DATASHEET DEBUG INTERFACE CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.
PAGE 15
TiWi-uB1 Module DATASHEET Figure 5 Slave Timing Figure 6 Slave Timing The information in this document is subject to change without notice.
PAGE 16
TiWi-uB1 Module DATASHEET AGENCY CERTIFICATIONS FCC ID: TFB-BT2, 15.247 IC ID: 5969A-BT2, RSS 210 CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489 AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
PAGE 17
TiWi-uB1 Module DATASHEET Industry Canada Statements This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.
PAGE 18
TiWi-uB1 Module DATASHEET OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The TiWi-uB1 Module has been certified for integration into products only by OEM integrators under the following conditions: The antennas for this transmitter must not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter procedures. Co-location means having a separation distance of less than 20 cm between transmitting antennas.
PAGE 19
TiWi-uB1 Module DATASHEET OEM LABELING REQUIREMENTS FOR END-PRODUCT The TiWi-uB1 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module.
PAGE 20
TiWi-uB1 Module DATASHEET OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. Other user manual statements may apply. L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.
PAGE 21
TiWi-uB1 Module DATASHEET EUROPE CE Notice This device has been tested and certified for use in the European Union. See the Declaration of Conformity (DOC) for specifics. If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and Telecommunications Terminal Equipment (R&TTE) Directive.
PAGE 22
TiWi-uB1 Module DATASHEET CONTACTING LS RESEARCH Headquarters LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: 1(262) 375-4400 Fax: 1(262) 375-4248 Website www.lsr.com Wiki www.lsr.com/products-wiki Technical Support www.lsr.com/products-forum Sales Contact sales@lsr.com The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products.