User Manual

TiWi-uB2 / uBleu2 Module
DATASHEET
The information in this document is subject to change without notice.
TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 15 of 25
SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Figure 6 Recommended Soldering Profile
Note: The quality of solder joints on the surface mount pads where they contact the host
board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of
Electronic Assemblies, section 8.2.1 “Bottom Only Terminations.”