User's Manual
Table Of Contents
- 1 Overview and Key Features
- 2 Specification
- 2.1 Specification Summary
- 3 Hardware Specifications
- 3.3.4 OTA (Over-the-Air) smartBASIC Application Download
- 4 Power Consumption
- 5 Functional Description
- 5.1 Power Management (includes Brown-out and Power on Reset)
- 5.2 Clocks and Timers
- 5.3 Memory for smartBASIC Application Code
- 5.4 Radio Frequency (RF)
- 5.5 NFC
- 5.6 UART Interface
- 5.7 SPI Bus
- 5.8 I2C Interface
- 5.9 General Purpose I/O, ADC, PWM and FREQ
- 5.10 nRESET pin
- 5.11 nAutoRUN pin
- 5.12 vSP Command Mode
- 5.13 Two-wire Interface JTAG
- 5.14 BL652 Wakeup
- 5.15 Low Power Modes
- 5.16 Temperature Sensor
- 5.17 Random Number Generator
- 5.18 AES Encryption/Decryption
- 5.19 Optional External Serial (SPI) Flash
- 5.20 Optional External 32.768 kHz crystal
- 5.21 BL652-SA On-board Chip Antenna Characteristics
- 6 Hardware Integration Suggestions
- 7 Mechanical Details
- 8 Application Note for Surface Mount Modules
- 9 FCC and IC Regulatory Statements
- 10 Japan (MIC) Regulatory
- 11 CE Regulatory
- 12 EU Declarations of Conformity
- 13 Ordering Information
- 14 Bluetooth SIG Qualification
BL652
Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
57
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Europe: +44-1628-858-940
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Table 30: Recommended baking times and temperatures
MSL
125°C
Baking Temp.
90°C/≤ 5%RH
Baking Temp.
40°C/ ≤ 5%RH
Baking Temp.
Saturated
@
30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@
30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@
30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
3
9 hours
7 hours
33 hours
23 hours
13 days
9 days
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to
J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 19: Recommended reflow temperature
Temperatures should not exceed the minimums or maximums presented in Table 31.
Table 31: Recommended maximum and minimum temperatures
Specification
Value
Unit
Temperature Inc./Dec. Rate (max)
1~3
°C / Sec
Temperature Decrease rate (goal)
2-4
°C / Sec
Soak Temp Increase rate (goal)
.5 - 1
°C / Sec
Flux Soak Period (Min)
70
Sec
Flux Soak Period (Max)
120
Sec
Flux Soak Temp (Min)
150
°C
Flux Soak Temp (max)
190
°C
Time Above Liquidous (max)
70
Sec