User's Manual
Table Of Contents
- 1 Overview and Key Features
- 2 Specification
- 2.1 Specification Summary
- 3 Hardware Specifications
- 3.3.4 OTA (Over-the-Air) smartBASIC Application Download
- 4 Power Consumption
- 5 Functional Description
- 5.1 Power Management (includes Brown-out and Power on Reset)
- 5.2 Clocks and Timers
- 5.3 Memory for smartBASIC Application Code
- 5.4 Radio Frequency (RF)
- 5.5 NFC
- 5.6 UART Interface
- 5.7 SPI Bus
- 5.8 I2C Interface
- 5.9 General Purpose I/O, ADC, PWM and FREQ
- 5.10 nRESET pin
- 5.11 nAutoRUN pin
- 5.12 vSP Command Mode
- 5.13 Two-wire Interface JTAG
- 5.14 BL652 Wakeup
- 5.15 Low Power Modes
- 5.16 Temperature Sensor
- 5.17 Random Number Generator
- 5.18 AES Encryption/Decryption
- 5.19 Optional External Serial (SPI) Flash
- 5.20 Optional External 32.768 kHz crystal
- 5.21 BL652-SA On-board Chip Antenna Characteristics
- 6 Hardware Integration Suggestions
- 7 Mechanical Details
- 8 Application Note for Surface Mount Modules
- 9 FCC and IC Regulatory Statements
- 10 Japan (MIC) Regulatory
- 11 CE Regulatory
- 12 EU Declarations of Conformity
- 13 Ordering Information
- 14 Bluetooth SIG Qualification
BL652
Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
56
© Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
The following package label is located on both sides of the master carton:
Figure 17: Master carton package label
The following is the packing slip label:
Figure 18: Packing slip label
Reflow Parameters
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New
packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained
during storage and shipment. If directed to bake units on the card, see Table 30 and follow instructions specified
by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website:
http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures
displayed in in Table 30, the modules must be removed from the shipping tray.
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and
a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient
environment 30°C/60%RH.