User's Manual
Table Of Contents
- 1 Overview and Key Features
- 2 Specification
- 2.1 Specification Summary
- 3 Hardware Specifications
- 3.3.4 OTA (Over-the-Air) smartBASIC Application Download
- 4 Power Consumption
- 5 Functional Description
- 5.1 Power Management (includes Brown-out and Power on Reset)
- 5.2 Clocks and Timers
- 5.3 Memory for smartBASIC Application Code
- 5.4 Radio Frequency (RF)
- 5.5 NFC
- 5.6 UART Interface
- 5.7 SPI Bus
- 5.8 I2C Interface
- 5.9 General Purpose I/O, ADC, PWM and FREQ
- 5.10 nRESET pin
- 5.11 nAutoRUN pin
- 5.12 vSP Command Mode
- 5.13 Two-wire Interface JTAG
- 5.14 BL652 Wakeup
- 5.15 Low Power Modes
- 5.16 Temperature Sensor
- 5.17 Random Number Generator
- 5.18 AES Encryption/Decryption
- 5.19 Optional External Serial (SPI) Flash
- 5.20 Optional External 32.768 kHz crystal
- 5.21 BL652-SA On-board Chip Antenna Characteristics
- 6 Hardware Integration Suggestions
- 7 Mechanical Details
- 8 Application Note for Surface Mount Modules
- 9 FCC and IC Regulatory Statements
- 10 Japan (MIC) Regulatory
- 11 CE Regulatory
- 12 EU Declarations of Conformity
- 13 Ordering Information
- 14 Bluetooth SIG Qualification
BL652
Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
16
© Copyright 2016 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
Parameter
Min
Typ
Max
Unit
VCC Maximum ripple or noise
2
-
-
10
mV
VCC rise time (0 to 1.7V)
3
-
-
60
mS
Operating Temperature Range
-40
-
+85
ºC
Recommended Operating Parameters Notes:
Note 1
4.7 uF internal to module on VCC. In smartBASIC runtime engine firmware, use of the internal DCDC
convertor or LDO is decided by the underlying BLE stack.
Note 2
This is the maximum VCC ripple or noise (at any frequency) that does not disturb the radio.
Note 3
The on-board power-on reset circuitry may not function properly for rise times outside the noted
interval.
Table 5: Signal levels for interface, SIO
Parameter
Min
Typ
Max
Unit
V
IH
Input high voltage
0.7 VDD_nRF
VDD_nRF
V
V
IL
Input low voltage
VSS
0.3 x VDD_nRF
V
V
OH
Output high voltage
(std. drive, 0.5mA) (Note 1)
(high-drive, 3mA) (Note 1)
(high-drive, 5mA) (Note 2)
VDD_nRF -0.4
VDD_nRF -0.4
VDD_nRF -0.4
VDD_nRF
VDD_nRF
VDD_nRF
V
V
V
OL
Output low voltage
(std. drive, 0.5mA) (Note 1)
(high-drive, 3mA) (Note 1)
(high-drive, 5mA) (Note 2)
VSS
VSS
VSS
VSS+0.4
VSS+0.4
VSS+0.4
V
V
V
OL
Current at VSS+0.4V,Output set low
(std. drive, 0.5mA) (Note 1)
(high-drive, 3mA) (Note 1)
(high-drive, 5mA) (Note 2)
1
3
6
2
-
10
4
-
15
mA
mA
mA
V
OL
Current at VDD_nRF -0.4, Output set low
(std. drive, 0.5mA) (Note 1)
(high-drive, 3mA) (Note 1)
(high-drive, 5mA) (Note 2)
1
3
6
2
-
9
4
-
14
mA
mA
mA
Pull up resistance
11
13
16
kΩ
Pull down resistance
11
13
16
kΩ
Pad capacitance
3
pF
Pad capacitance at NFC pads
4
pF