A Datasheet BL652-SA and BL652-SC Version 1.
BL652 Datasheet REVISION HISTORY Version Date 1.0 20 July 2016 1.1 30 Aug 2016 Notes Approver Initial Release Corrected Operating Temperature voltage to read VCC 1.8 V-3.6 V rather than 1.7 V-3.6V Corrected minor formatting issues and typo Changed the SIO_02 pin # (OTA mode table) to 23 vs. 21 Jonathan Kaye Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 2 © Copyright 2016 Laird.
BL652 Datasheet CONTENTS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Overview and Key Features ................................................................................................................................. 4 Specification......................................................................................................................................................... 5 Hardware Specifications ..................................................................................................
BL652 Datasheet 1 OVERVIEW AND KEY FEATURES Every BL652 Series module is designed to enable OEMs to add single-mode Bluetooth Low Energy (BLE) v4.2 to small, portable, power-conscious devices. The BL652 modules are supported with Laird’s smartBASIC, an eventdriven programming language that enables OEMs to make their BLE product development quicker and simpler, significantly reducing time to market.
BL652 Datasheet 2 SPECIFICATION Specification Summary Table 1: BL652 Specifications Categories Feature Wireless Specification Bluetooth® Implementation V4.2 – Single mode Concurrent master and slave Diffie-Hellman based pairing 2.402 - 2.
BL652 Datasheet Categories Feature Implementation Up to 32, with configurable: I/O direction, O/P drive strength (standard 0.5 mA or high 3mA/5 mA), Pull-up /pull-down Eight 8/10/12-bit channels 0.6 V internal reference Configurable 4, 2, 1, 1/2, 1/3, 1/4, 1/5 1/6(default) pre-scaling Configurable acquisition time 3uS, 5uS, 10uS(default), 15uS, 20uS, 40uS. One-shot mode PWM outputs on 12 GPIO output pins.
BL652 Datasheet Categories Operating Modes Feature Implementation Selected by nAutoRun pin status: LOW (0V). Then runs $autorun$ (smartBASIC application script) if it exists. HIGH (VCC). Then runs via at+run (and file name of smartBASIC application script). 1.8- 3.
BL652 Datasheet Module Specification Notes: Note 2 With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL must be connected externally as per I2C standard. Note 3 SPI interface (master) consists of SPI MOSI, SPI MISO, and SPI CLK. SPI CS is created by using any spare SIO pin within the smartBASIC application script allowing multi-dropping.
BL652 Datasheet 3 HARDWARE SPECIFICATIONS Block Diagram and Pin-out Figure 1: BL652 Block diagram Figure 2: Functional HW and SW block diagram for BL652 series BLE smartBASIC module Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 9 © Copyright 2016 Laird.
BL652 Datasheet Figure 3: BL652-Sx module pin-out (top view) Pin Definitions Table 2: Pin definitions Pin # Pin Name Default Function Alternate Function In/ Out Pull Up/ Down nRF52832 QFN Pin nRF52832 QFN Name 1 GND - - - - - - Comment Laird Devkit: SPI EEPROM. SPI_Eeprom_MISO, Input. 2 SIO_24/ SPI_MISO SIO_24 SPI_MISO IN PULLUP 29 PO.24 SPIOPEN() in smartBASIC selects SPI function; MOSI and CLK are outputs when in SPI master mode. Laird Devkit: SPI EEPROM.
BL652 Datasheet Pin # Pin Name Default Function Alternate Function In/ Out Pull Up/ Down nRF52832 QFN Pin nRF52832 QFN Name 6 SWDCLK SWDCLK - - PULLDOWN 25 SWDCLK - 7 nRESET nRESET - IN PULLUP 24 PO.21/ nRESET System Reset (Active Low) Comment Laird Devkit: Optional External serial SPI flash for data logging purpose. 8 SIO_20/ SFLASH_MOSI SIO_20 SFLASH_MOSI IN PULLUP 23 PO.20 9 SIO_18 SIO_18 - IN PULLUP 21 PO.
BL652 Datasheet Pin # Pin Name Default Function Alternate Function In/ Out Pull Up/ Down nRF52832 QFN Pin nRF52832 QFN Name Comment 23 SIO_02/ AIN0 SIO_02 AIN0 IN PULLDOWN 4 PO.02/AIN0 Internal pull-down 24 SIO_01/ XL2 SIO_01 XL2 IN PULLUP 3 PO.01/XL2 Laird Devkit: Optional 32.768kHz crystal pad XL2 25 SIO_00/ XL1 SIO_00 XL1 IN PULLUP 2 PO.00/XL1 Laird Devkit: Optional 32.768kHz crystal pad XL1 26 VDD_nRF - - - - - - 1.7V to 3.
BL652 Datasheet Pin Definition Notes: Note 2 DIO = Digital Input or Output. I/O voltage level tracks VCC. Note 3 AIN = Analog Input Note 4 DIO or AIN functionality is selected using the GpioSetFunc() function in smartBASIC. Note 5 AIN configuration selected using GpioSetFunc() function. Note 6 I2C, UART, SPI controlled by xxxOPEN() functions in smartBASIC. Note 7 SIO_5 to SIO_8 are DIO by default when $autorun$ app runs on power-up. Note 8 JTAG (two-wire SWD interface), pin 5 (SWDIO) and pin 6 (SWDCLK).
BL652 Datasheet Pin Definition Notes: SIO_02 is an input set with internal pull-down (in the firmware). It is used for OTA downloading of smartBASIC applications. Refer to the latest firmware release documentation for details. Note 14 Not required for BL652 module normal operation.
BL652 Datasheet Pin 28 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BL652-xx) it is connected so that the state is driven by the host’s DTR output line.
BL652 Datasheet Parameter VCC Maximum ripple or noise2 Min - Typ - Max 10 Unit mV VCC rise time (0 to 1.7V)3 Operating Temperature Range -40 - 60 +85 mS ºC Recommended Operating Parameters Notes: Note 1 4.7 uF internal to module on VCC. In smartBASIC runtime engine firmware, use of the internal DCDC convertor or LDO is decided by the underlying BLE stack. Note 2 This is the maximum VCC ripple or noise (at any frequency) that does not disturb the radio.
BL652 Datasheet Signal Levels Notes: Note 1 For VDD_nRF≥1.7V. The smartBASIC firmware supports high drive (3 mA, as well as standard drive). Note 2 For VDD_nRF≥2.7V. The smartBASIC firmware supports high drive (5 mA (since VDD_nRF≥2.7V), as well as standard drive). Table 6: SIO pin alternative function AIN (ADC) specification Parameter ADC Internal reference voltage ADC pin input internal selectable scaling Min Typ Max Unit -1.5% 0.6 V 4, 2, 1, 1/2, 1/3, 1/4, 1/5 1/6 +1.
BL652 Datasheet 3.3.3 nAutoRUN Pin and Operating Modes Operating modes (refer to the smartBASIC guide for details): Self-contained mode Interactive/Development mode Table 7: nAutoRUN pin Signal Name nAutoRUN /(SIO_13) Pin # 28 I/O I Comments Input with active low logic. Internal pull down (default).
BL652 Datasheet 4 POWER CONSUMPTION Data taken at VCC_nRF of 3.0 V with internal (to chipset) LDO ON or with internal (to chipset) DCDC ON (see Note 1) and 25ºC.
BL652 Datasheet that are enabled stay on and may re-awaken the chip. Depending on active peripherals, current consumption ranges from ~1.2 µA to 270 uA (when UART is ON). See individual peripherals current consumption data in the Peripheral Block Current Consumption section. smartBASIC runtime engine firmware has added new functionality to detect GPIO change with no current consumption cost, it is possible to close the UART and get to the 1.
BL652 Datasheet Other factors that are also related to average current consumption include: Whether transmitting six packets per connection interval with each packet containing 20 bytes (which is the maximum for each packet) An inaccurate 32.768 kHz master clock accuracy would increase the average current consumption.
BL652 Datasheet TX power – 4 dBm Interval – 7.5 ms 29 byte payload Advertising interval – 20 ms TX: 8.55 mA RX: 6 mA Average current for BLE connection Figure 5: Typical peak current consumption profile (with DCDC ON) during data connection event in slave mode @ TX PWR +4dBm UART is OFF Note: In the above pictures, UART is OFF. Y-axis current (1.3 mA per square).
BL652 Datasheet Adding the IDLE current (StandbyDoze mode) to the inactive part of the interval: TOT_avg = BLE_avg + IDLE * (BLE_interval - BLE_length) / BLE_interval Performing the calculation with the numbers 25mS advertising internal and TX power for 4dBm for example: BLE_charge = 4.377 ms * 2.91 mA = 12.74 uC BLE_avg = 12.74 uC / 25 ms + 5 ms) = 509.78 uA TOT_avg = 509.78 uA + 2 uA * (25 ms - 4.377 ms)/25 ms = 511.
BL652 Datasheet Table 11: Measured total average current consumption profile – for a minimum advertising interval of 10240 ms TX Power (dBm) Average Advert (Burst) Current (uA) Average Advert (Burst) Duration (mS) BLE Advert Charge (uC) 4 0 2911.726 2431.095 4.377 4.377 12744.625 10640.903 -4 -8 -12 -16 -20 2163.884 2151.602 2086.596 2052.041 2029.615 4.377 4.377 4.377 4.377 4.377 -40 1960.112 4.
BL652 Datasheet TX power: 0 dBm Advert 29 byte payload 20 ms interval Average BLE advert current burst (excluding advertising interval): 2.431 mA Aside: Peak TX current: 6 mA Peak RX current: 6 mA TX power: -4 dBm Advert 29 byte payload 20 ms interval Average BLE advert current burst (excluding advertising Interval): 2.163 mA Aside: Peak TX current: 4.98 mA Peak RX current: 5.99 mA Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.
BL652 Datasheet TX power: -8 dBm Advert 29 byte payload 20 ms interval Average BLE advert current burst (excluding advertising Interval): 2.151 mA Aside: Peak TX current: 4.59 mA Peak RX current: 5.98 mA TX power: -12 dBm Advert 29 byte payload 20 ms interval Average BLE advert current burst (excluding advertising Interval): 2.086 mA Aside: Peak TX current: 4.34 mA Peak RX current: 5.99 mA Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.
BL652 Datasheet TX power: -16 dBm Advert 29 byte payload 20 ms interval Average BLE advert current burst (excluding advertising Interval): 2.052 mA Aside: Peak TX current: 4.16 mA Peak RX current: 5.99 mA TX power: -20 dBm Advert 29 byte payload 20 ms interval Average BLE advert current burst (excluding advertising Interval): 2.029 mA Aside: Peak TX current: 4.03 mA Peak RX current: 5.99 mA Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.
BL652 Datasheet TX power: -40 dBm Advert 29 byte payload 20 ms interval Average BLE advert current burst (excluding advertising Interval): 1.960 mA Refer to table for worked out total BLE advert average current for given advertising interval. Aside: Peak TX current: 3.6 mA Peak RX current: 6.01 mA Table 13 and Table 14 has the measured "Average Connection (Burst) current" (for a given TX power) which can be used to calculate the Total average current for any connection interval.
BL652 Datasheet Table 14: Measured Total average current consumption profile (with DCDC ON) during connection in slave mode versus TX POWER for minimum Connection interval of 4000mS. UART is OFF TX power (dBm) Average Connection (Burst) Current (uA) Average Connection (Burst) Duration (mS) BLE Connection Charge (uC) BLE Connection Interval (mS) BLE Connection Average (uA) Max Standby Doze Current (uA) BLE Connection Interval 7.5 ms Total Average Current (uA) 4 1670.956 2.3 3843.199 4000 0.
BL652 Datasheet TX power: 0 dBm Connection 29 byte payload (2.3 ms) 7.5 ms interval Average BLE connection burst current (excluding connection Interval): 1.56 mA Aside: Peak RX current: 5.92 mA Peak TX current: 5.96 mA TX power: -4 dBm Connection 29 byte payload (2.3 ms) 7.5 ms interval Average BLE connection burst current (excluding connection Interval): 1.513 mA Aside: Peak RX current: 5.94 mA Peak TX current: 4.95 mA Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.
BL652 Datasheet TX power: -8 dBm Connection 29 byte payload (2.3 ms) 7.5 ms interval Average BLE connection burst current (excluding connection Interval): 1.492 mA Aside: Peak RX current: 5.92 mA Peak TX current: 4.58 mA TX power: -12 dBm Connection 29 byte payload (2.3 ms) 7.5 ms interval Average BLE connection burst current (excluding connection Interval): 1.488 mA Aside: Peak RX current: 5.93 mA Peak TX current: 4.30 mA Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.
BL652 Datasheet TX power: -16 dBm Connection 29 byte payload (2.3 ms) 7.5 ms interval Average BLE connection burst current (excluding connection Interval): 1.469 mA Aside: Peak RX current: 5.94 mA Peak TX current: 4.17 mA TX power: -20 dBm Connection 29 byte payload (2.3 ms) 7.5 ms interval Average BLE connection burst current (excluding connection Interval): 1.454 mA Aside: Peak RX current: 5.95 mA Peak TX current: 4.03 mA Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.
BL652 Datasheet TX power: -40 dBm Connection 29 byte payload (2.3 ms) 7.5 ms interval Average BLE connection burst current (excluding connection Interval): 1.428 mA Aside: Peak RX current: 5.94 mA Peak TX current: 3.62 mA Peripheral Block Current Consumption The values below are calculated for a typical operating voltage of 3V.
BL652 Datasheet Table 19: ADC power consumption Parameter ADC current during conversion Min - Typ 700 Max - Unit uA The above current consumption is for the given peripheral only and to operate that peripheral requires some other internal blocks which consume base current. This base current is consumed when the UART, SPI, I2C, or ADC is opened (operated).
BL652 Datasheet Clocks and Timers 5.2.1 Clocks The integrated high accuracy 32 MHz (±10 ppm) crystal oscillator helps with radio operation and reducing power consumption in the active modes. The integrated on-chip 32.768 kHz RC oscillator (±250 ppm) provides protocol timing and helps with radio power consumption in the system StandByDoze and Deep Sleep modes by reducing the time that the RX window needs to be open. To keep the on-chip 32.
BL652 Datasheet – Date rate 106 kbps – NFC-A tag (can only be a target/tag; cannot be an initiator) Modes of Operation: – Disable – Sense – Activated 5.5.
BL652 Datasheet Some serial implementations link CTS and RTS to remove the need for handshaking. We do not recommend linking CTS and RTS other than for testing and prototyping. If these pins are linked and the host sends data at the point that the BL652 deasserts its RTS signal, then there is significant risk that internal receive buffers will overflow, which could lead to an internal processor crash. This will drop the connection and may require a power cycle to reset the module.
BL652 Datasheet An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR type bus consisting of two lines which normally sit at VCC. The BL652 module can only be configured as an I2C master with additional constraint that it be the only master on the bus. The SCL is the clock line which is always sourced by the master and SDA is a bi-directional data line which can be driven by any device on the bus.
BL652 Datasheet 5.9.3 PWM Signal Output on up to 12 SIO Pins The PWM output is an alternate function on SIO pins, configurable by smartBASIC. The ability to output a PWM (Pulse Width Modulated) signal on ALL GPIO (SIO) output pins can be selected using GpioSetFunc() function. The PWM output signal has a frequency and duty cycle property. Frequency is adjustable (up to 1MHz ) and the duty cycle can be set over a range from 0% to 100% (both configurable by smart BASIC command). 5.9.
BL652 Datasheet Figure 7: Differences between VSP bridge to UART mode and VSP Command mode Table 25: vSP modes Mode VSP Bridge to UART Mode VSP Command Mode SIO_02 High High nAutoRUN High Low SIO_02 High (externally) selects the VSP service. When SIO_02 is High and nAutoRUN is Low (externally), this selects VSP Command mode. When SIO_12 is High and nAutoRUN is High (externally), this selects VSP Bridge to UART mode.
BL652 Datasheet The Laird DVK-BL652 development board incorporates an on-board JTAG J-link programmer for this purpose. There is also the following JTAG connector which allows on-board JTAG J-link programmer signals to be routed off the development board. The only requirement is that you should use the following JTAG connector on the host PCB. The JTAG connector MPN is as follows: Reference Part Description and MPN (Manufacturers Part Number) JP1 FTSH-105 Header, 1.
BL652 Datasheet Note: J3 and J4 (on the DVK-BL652-xx development board allows Laird on-board JTAG J-link programmer signals to be routed off the development board by fitting jumpers in the J3 pins (2-3) and J4 pins (2-3). BL652 Wakeup 5.14.1 Waking Up BL652 from Host Wake the BL652 from the host using wake-up pins (any SIO pin). Refer to the smartBASIC user guide for details.
BL652 Datasheet Optional External Serial (SPI) Flash This is not required for normal BL652 module opertion. If you fit an optional external serial (SPI) flash (such as for data logging purpose) then that external serial (SPI) flash must connect to BL652 module pins SIO_12 (SFLASH_CS), SIO_14 (SFLASH_MISO), SIO_16 (SFLASH_CLK), and SIO_20 (SFLASH_MOSI); in that case a high level API in smartBASIC can be used for fast access using open/close /read/write API functions. Note: By default, these are GPIO pins.
BL652 Datasheet BL652 On-chip 32.768 kHz RC Oscillator (±250 ppm) LFRC Optional External Higher Accuracy (±20 ppm) 32.768 kHz Crystal-based Oscillator XO Calibration required regularly (default eight seconds interval) Calibration takes 16-17 ms; with DCDC used, the total charge of a calibration event is 7.4 uC.
BL652 Datasheet Optional external 32.768kHz crystal Min Typ Max Drive level - - 1 uW Input capacitance on XL1 and XL2 pads - 4 pF - Run current for 32.768 kHz crystal based oscillator - 0.25 uA - Startup time for 32.768 kHz crystal based oscillator - 0.
BL652 Datasheet Table 28: BL652-SA on-board chip antenna performance (Antenna Gain, efficiency and S11 (whilst BL652-SA-xx module on DVKBL652-xx development board) 6 HARDWARE INTEGRATION SUGGESTIONS Circuit The BL652 is easy to integrate, requiring no external components on your board apart from those which you require for development and in your end application. The following are suggestions for your design for the best performance and functionality.
BL652 Datasheet UART Required for loading your smartBASIC application script during development (or for subsequent firmware upgrades (except JTAG for FW upgrades and/or Flash Cloning of the smartBASIC application script). Add connector to allow interfacing with UART via PC (UART–RS232 or UART-USB). UART_RX and UART_CTS SIO_8 (alternative function UART_RX) is an input, set with internal weak pull-up (in firmware).
BL652 Datasheet Add tuning capacitors of 300 pF on NGC1 pin to GND and 300 pF on NFC2 pins to GND if the PCB track length is similar as DVK-BL652 devboard. nRESET pin (active low) Hardware reset. Wire out to push button or drive by host. By default module is out of reset when power applied to VCC pins. Optional External 32.768kHz crystal If the optional external 32.768kHz crystal is needed then use a crystal that meets specification.
BL652 Datasheet The BL652-SA antenna is tuned when BL652-SA is sitting on development board (host PCB) with size of 120 mm x 93 mm. A different host PCB thickness dielectric will have small effect on antenna. The antenna-keep-out defined in the Host PCB Land Pattern and Antenna Keep-out for BL652-SA section. Host PCB land pattern and antenna keep-out for the BL652 applies when the BL652-SA is placed in the corner of the host PCB.
BL652 Datasheet Any metal closer than 20 mm will begin to significantly degrade performance (S11, gain, radiation efficiency). It is best that you test the range with a mock-up (or actual prototype) of the product to assess effects of enclosure height (and materials, whether metal or plastic). External Antenna Integration with BL652-SC Please refer to the regulatory sections for FCC, IC, CE, and Japan for details of use of BL652-Sx with external antennas in each regulatory region.
BL652 Datasheet 7 MECHANICAL DETAILS BL652 Mechanical Details Figure 10: BL652 mechanical drawings Development Kit Schematics can be found in the software downloads tab of the BL652 product page: http://www.lairdtech.com/Products/BL652-Series Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 51 © Copyright 2016 Laird.
BL652 Datasheet Host PCB Land Pattern and Antenna Keep-out for BL652-SA Figure 11: Land pattern and Keep-out for BL652-SA All dimensions are in mm. Host PCB Land Pattern and Antenna Keep-out for BL652-SANotes: Note 1 Ensure there is no copper in the antenna ‘keep out area’ on any layers of the host PCB. Also keep all mounting hardware or any metal clear of the area (Refer to 6.3.2) to reduce effects of proximity detuning the antenna and to help antenna radiate properly.
BL652 Datasheet Note 4 Ensure that there is no exposed copper under the module on the host PCB. Note 5 You may modify the PCB land pattern dimensions based on their experience and/or process capability. 8 APPLICATION NOTE FOR SURFACE MOUNT MODULES Introduction Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the User Manual.
BL652 Datasheet Figure 13: Tape specifications There are 1000 BL652 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (5000 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See Carton Contents for more information. 8.2.2 Carton Contents The following are the contents of the carton shipped for the BL652 modules. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.
BL652 Datasheet Figure 14: Carton contents for the BL652 8.2.3 Packaging Process Figure 15: BL652 packaging process 8.2.4 Labeling The following labels are located on the antistatic bag: Figure 16: Antistatic bag labels Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 55 © Copyright 2016 Laird.
BL652 Datasheet The following package label is located on both sides of the master carton: Figure 17: Master carton package label The following is the packing slip label: Figure 18: Packing slip label Reflow Parameters Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment.
BL652 Datasheet Table 30: Recommended baking times and temperatures MSL 3 125°C Baking Temp. 40°C/ ≤ 5%RH Baking Temp. 90°C/≤ 5%RH Baking Temp. Saturated @ 30°C/85% Floor Life Limit + 72 hours @ 30°C/60% Saturated @ 30°C/85% Floor Life Limit + 72 hours @ 30°C/60% 9 hours 7 hours 33 hours 23 hours Saturated @ 30°C/85% 13 days Floor Life Limit + 72 hours @ 30°C/60% 9 days Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
BL652 Datasheet Specification Time Above Liquidous (min) Time In Target Reflow Range (goal) Time At Absolute Peak (max) Liquidous Temperature (SAC305) Lower Target Reflow Temperature Upper Target Reflow Temperature Absolute Peak Temperature Value 50 30 5 218 240 250 260 Unit Sec Sec Sec °C °C °C °C 9 FCC AND IC REGULATORY STATEMENTS Model BL652-SA US/FCC Canada/IC SQGBL652 3147A-BL652 BL652-SC SQGBL652 3147A-BL652 The BL652SA and BL652-SC hold full modular approvals.
BL652 Datasheet Power Exposure Information Federal Communication Commission (FCC) Radiation Exposure Statement: This EUT is in compliance with SAR for general population/uncontrolled exposure limits in ANSI/IEEE C95.1-1999 and had been tested in accordance with the measurement methods and procedures specified in OET Bulletin 65 Supplement C. This transceiver must not be co-located or operating in conjunction with any other antenna, transmitter, or external amplifiers.
BL652 Datasheet Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.
BL652 Datasheet (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
BL652 Datasheet l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The final end product must be labeled in a visible area with the following: “Contains IC: 3147A-BL652”. Plaque signalétique du produit final Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 3147ABL652".
BL652 Datasheet 11 CE REGULATORY The BL652-SA/BL652-SC have been tested for compliance with relevant standards for the EU market. The BL652SC module was tested with a 2.21 dBi antenna. The OEM can operate the BL652-SC module with any other type of antenna but must ensure that the gain does not exceed 2.21 dBi to maintain the Laird approval.
BL652 Datasheet 12 EU DECLARATIONS OF CONFORMITY BL652-SA/BL652-SC Manufacturer: Product: EU Directive: Conformity Assessment: Laird BL652-SA, BL652-SC RTTE 1995/5/EC Annex IV Reference standards used for presumption of conformity: Article Number 3.1a 3.1b Requirement Health and Safety Protection requirements with respect to electromagnetic compatibility Reference standard(s) EN60950-1:2006+A11:2009+A1:2010+A12:2011 EN 301 489-1 V1.9.2 (2011-09) EN 301 489-17 V2.2.
BL652 Datasheet 13 ORDERING INFORMATION BL652-SA-0x Intelligent BTv4.2 Module featuring smartBASIC (internal antenna) BL652-SC-0x DVK-BL652-SA / SC-0x Intelligent BTv4.2 Module featuring smartBASIC (IPEX MHF4 connector) Development Kit for each BL652 series module above General Comments This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask.
BL652 Datasheet 3. Enter TBD or TBD in the End Product table entry. 4. Select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page. Note: Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG invoice is paid. 5. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document accessible from the site.
BL652 Datasheet Examples of LL components that can be combined into a new design are: Listing reference Design Name Core Spec Version TBD S130_nRF51xxx link layer 4.2 *Note: Please check with Laird/Nordic for applicable LL components. Examples of Host Stack components that can be integrated into the new design are; Listing reference Design Name Core Spec Version TBD S130_nRF51xxx host layer 4.2 *Note: You may choose any Host Stack and optional profiles in you design.
