User Manual

APEX/APEX LT
Datasheet (Preliminary Rev 0.2) www.lsr.com Page 17 of 20
The final choice of the soldering paste depends on individual factory approved manufacturing
procedures.
Stencil Thickness: 150 µm for host boards
Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC specification. See IPC-A-610-12.2.4.
14.4 Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the
module cannot be easily removed with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap
between the host board and the module. The combination of soldering flux residuals and
encapsulated water could lead to short circuits between neighboring pads. Water could also
damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals
into the two housings, which is not accessible for post-washing inspection. The solvent could also
damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post
soldering cleaning step.
14.5 Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the
following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
14.6 Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
14.7 Wave Soldering
If a wave soldering process is required on the host boards due to the presents of leaded
components, only a single wave soldering process is encouraged.
14.8 Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350ºC,
follow IPC recommendations/reference document IPC-7711.