User's Manual

SU60-SIPT
Datasheet
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15.3.2 Cautions When Removing the SIP from the Platform for RMA
 Bake the platform before removing the SIP from the platform. Reference baking conditions.
 Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician.
Suggestion conditions:
 One-side component platform:
– Set the hot plate at 280°C.
– Put the platform on the hot plate for 8~10 seconds.
– Remove the SIP from platform.
 Two-side components platform:
– Use two hot air guns
– On the bottom side, use a pre-heated nozzle (temperature setting of 200~250°C) at a suitable
distance from the platform PCB.
– On the top side, apply a remove nozzle (temperature setting of 330°C). Heat the SIP until it can be
removed from platform PCB.
 Remove the residue solder under the bottom side of SIP.
(Not accepted for RMA) (Accepted for RMA analysis)
SIP with residue solder on the bottom SIP without residue solder on the bottom
 Remove and clean the residue flux is needed.
Platform
SIP
Remove Nozzle
Pre
-
heat