User's Manual

SU60-SIPT
Datasheet
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– Period: 48 hours or less after opening
 Storage conditions for two-time soldering
Storage conditions following opening and prior to performing the 1
st
reflow:
– Temperature: 5~25℃
– Humidity: 60% or less
– Period: 48 hours or less after opening
Storage conditions following completion of the 1
st
reflow and prior to performing the 2
nd
reflow
– Temperature: 5~25℃
– Humidity: 60% or less
– Period: 48 hours or less after completion of the 1
st
reflow
15.1.3 Temporary Storage Requirements after Opening
The following are temporary storage requirements after opening:
 Only re-store the devices once prior to soldering.
 Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing
again using heat-sealing.
The following indicate the required storage period, temperature, and humidity for this temporary storage:
1. Storage temperature and humidity
*** - External atmosphere temperature and humidity of the dry packing
2. Storage period
– X1+X2 – Refer to After Opening the Dry Packing storage requirements.
– Y – Two weeks or less.
15.2 Baking Conditions
Baking conditions and processes for the SSD50NBT follow the J-STD-033 standard which includes the following:
 The calculated shelf life in a sealed bag is 12 months at <40℃ and <90% relative humidity.
 Once the packaging is opened, the SiP must be mounted (per MSL3/Moisture Sensitivity Level 3) within 168
hours at <30℃ and <60% relative humidity.
 If the SiP is not mounted within 168 hours or if, when the packaging is opened, the humidity indicator card
displays >10% humidity, then the product must be baked for 48 hours at 125℃ (±5℃).
Temperature: 5-40°C
Humidity: 80% or less
Temperature: 5-25°C
Humidity: 60% or less
Temperature: 5-40°C
Humidity: 80% or less
Temperature: 5-25°C
Humidity: 60% or less
***
***